Current-diverting guide plate for probe module and probe module using the same

Patent metadata

Field	Value
Publication number	US-9423424-B2
Application number	US-201414152755-A
Country	US
Kind code	B2
Filing date	Jan 10, 2014
Priority date	Jan 11, 2013
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

A current-diverting guide plate for use in a probe module is disclosed to include a plate body having a first surface, a second surface opposite to the first surface, and a plurality of through holes penetrating through the first and second surfaces. A conducting layer is provided at a periphery wall of each through hole of the plate body and electrically coupled to a probe slidably inserted through the through holes. A current-diverting circuit trace is disposed on the first surface of the plate body and electrically connected with the conducting layers for diverting the electric current flowing through probes. Thus, the current-diverting guide plate can be used to prevent the probes from possible damage due to an excessive instantaneous current.

First claim

What is claimed is:

1. A probe module comprising:
an upper guide plate including a plate body that has a first surface, a second surface opposite to the first surface, and a plurality of through holes penetrating through the first and second surfaces;
a lower guide plate spacedly disposed beneath the upper guide plate, the lower guide plate comprising:
a plate body having a first surface, a second surface opposite to the first surface, and a plurality of through holes penetrating through the first and second surfaces; and
a current-diverting circuit trace disposed on the first surface of the plate body of the lower guide plate; and
a plurality of probes each slidably inserted through one of the through holes of the plate body of the upper guide plate and one of the through holes of the plate body of the lower guide plate in a way that the probes each have a probe tip disposed beneath the lower guide plate and the probes are elastically deformable between the upper and lower guide plates when the probe tips contact a device under test;
wherein at least two of the probes are electrically connected with the current-diverting circuit trace of the lower guide plate; wherein the lower guide plate further comprises a plurality of conducting layers each provided at a periphery wall of one of the through holes of the plate body of the lower guide plate and electrically connected with the current-diverting circuit trace of the lower guide plate.

2. The probe module as claimed in claim 1 , wherein the upper guide plate comprises a current-diverting circuit trace disposed on the first surface of the plate body of the upper guide plate; the upper guide plate and the lower guide plate are spacedly arranged in a manner that the two second surfaces of the plate bodies of the upper and lower guide plates face to each other; the at least two of the probes that are electrically connected with the current-diverting circuit trace of the lower guide plate are electrically connected with the current-diverting circuit trace of the upper guide plate.

3. The probe module as claimed in claim 2 , wherein the upper guide plate further comprises a plurality of conducting layers each provided at a periphery wall of one of the through holes of the plate body of the upper guide plate and electrically connected with the current-diverting circuit trace of the upper guide plate.

4. The probe module as claimed in claim 1 , wherein the current-diverting circuit trace of the lower guide plate comprises at least one primary branch connected between two adjacent said conducting layers.

5. The probe module as claimed in claim 4 , wherein the current-diverting circuit trace of the lower guide plate comprises at least one secondary branch connected between the two adjacent conducting layers.

6. The probe module as claimed in claim 1 , wherein each of the conducting layers of the lower guide plate is a composite conducting layer comprising a metal base layer and a metal coating coated on a surface of the metal base layer.

7. The probe module as claimed in claim 6 , wherein the metal coating contains polymer particles.

Assignees

• Mpi Corp

Inventors

• Hsu Hsien-Ta
• Fan Horng-Kuang

Classifications

• G01R1/06711

  Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins · CPC title

• G01R1/07357

  with flexible bodies, e.g. buckling beams · CPC title

• G01R1/36 Primary

  Overload-protection arrangements or circuits for electric measuring instruments · CPC title

• G01R1/067

  Measuring probes · CPC title