Testing head for a test equipment of electronic devices
US-9423421-B2 · Aug 23, 2016 · US
Current applying device
US9322845B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9322845-B2 |
| Application number | US-201414269624-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 5, 2014 |
| Priority date | May 8, 2013 |
| Publication date | Apr 26, 2016 |
| Grant date | Apr 26, 2016 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A current applying device in which a contact electrode is destroyed firstly when a large current is applied in the event of failure. A probe device is configured by serially connecting a contact body that is to be in contact with the surface of a power semiconductor to apply a current and a pressing body assembly that presses the contact body so as to apply the current to the power semiconductor and is configured so that, when the pressing body power applied to the pressing body assembly is smaller than the withstand power of the pressing body assembly, the contact body power applied to the contact body is larger than the withstand power of the contact.
First claim
Opening claim text (preview).
What is claimed is: 1. A current applying device which is configured by serially connecting a contact electrode which is to be in contact with a surface of a semiconductor to apply a current and a pressing body which presses the contact electrode and applies the current to the semiconductor, wherein the current applying device is configured so that when a pressing body power applied to the pressing body is smaller than a withstand power of the pressing body, a contact electrode power applied to the contact electrode is larger than a withstand power of the contact electrode, wherein the pressing body power is calculated based on a resistance of the pressing body itself and a contact resistance between the pressing body and the contact electrode, and wherein the contact electrode power is calculated based on a resistance of the contact electrode itself and a contact resistance between the contact electrode and the semiconductor. 2. The current applying device according to claim 1 , wherein the pressing body includes a plurality of elastic bodies, and wherein a relationship where the pressing body power applied to the pressing body is smaller than the withstand power of the pressing body is equal to a relationship where an elastic body power applied to one elastic body of all the elastic bodies is smaller than a withstand power of one elastic body.
Assignees
Inventors
Classifications
Overload-protection arrangements or circuits for electric measuring instruments · CPC title
- G01R1/06716Primary
Elastic · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9322845B2 cover?
- A current applying device in which a contact electrode is destroyed firstly when a large current is applied in the event of failure. A probe device is configured by serially connecting a contact body that is to be in contact with the surface of a power semiconductor to apply a current and a pressing body assembly that presses the contact body so as to apply the current to the power semiconducto…
- Who is the assignee on this patent?
- Honda Motor Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification G01R1/06716. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Apr 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).