Dicing method

Patent metadata

Field	Value
Publication number	US-9421640-B2
Application number	US-201414764962-A
Country	US
Kind code	B2
Filing date	Jan 21, 2014
Priority date	Jan 31, 2013
Publication date	Aug 23, 2016
Grant date	Aug 23, 2016

Abstract

The method comprises providing a substrate like a semiconductor wafer ( 1 ), applying a laser cut ( 4 ) of the substrate, and subsequently applying a saw to divide the substrate from a main surface ( 10 ). The laser cut ( 4 ) may be used to cut along boundaries of saw streets ( 7 ).

First claim

The invention claimed is:

1. A dicing method, comprising:
providing a semiconductor wafer as a substrate;
applying a saw to divide the substrate from a main surface;
performing a laser cut of the substrate before the saw is applied; and
directing the laser cut to a partial volume of the substrate opposite the main surface, the partial volume including a layer of integrated components.

2. The method of claim 1 , wherein the laser cut is directed to lateral boundaries of a saw street.

3. The method of claim 1 , wherein the laser cut allows the substrate to be divided with the saw not completely penetrating the substrate.

4. The method of claim 1 , wherein the partial volume amounts to more than 5% and less than 40% of the total volume of the substrate.

5. The method of claim 1 , wherein the partial volume amounts to more than 10% and less than 30% of the total volume of the substrate.

6. The method of claim 1 , wherein the substrate comprises glass or ceramics.

7. The method of claim 1 , wherein the substrate is provided for microelectromechanical systems.

8. A dicing method, comprising:
providing a semiconductor wafer as a substrate having a main surface;
forming integrated components in a partial volume of the substrate opposite the main surface;
performing a laser cut from the main surface into the partial volume of the substrate; and
applying a saw to divide the substrate from the main surface.

Assignees

• Ams Ag

Inventors

• Draxler Walter

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• B28D5/022 Primary

  by cutting with discs or wheels · CPC title

• C03B33/0222

  Scoring using a focussed radiation beam, e.g. laser · CPC title

• B81C1/00531

  Dry etching · CPC title

• H01L21/78

  Electricity · mapped topic