Methods of making an inkjet print head by sawing discontinuous slotted recesses

Patent metadata

Field	Value
Publication number	US-9346273-B2
Application number	US-201313906477-A
Country	US
Kind code	B2
Filing date	May 31, 2013
Priority date	May 31, 2013
Publication date	May 24, 2016
Grant date	May 24, 2016

Abstract

A method of making an inkjet print head may include forming, by sawing with a rotary saw blade, first discontinuous slotted recesses in a first surface of a wafer. The first discontinuous slotted recesses may be arranged in parallel, spaced apart relation. The method may further include forming, by sawing with the rotary saw blade, second discontinuous slotted recesses in a second surface of the wafer aligned and coupled in communication with the first continuous slotted recesses to define through-wafer channels. In another embodiment, the first and second plurality of discontinuous recesses may be formed by respective first and second rotary saw blades.

First claim

That which is claimed is:

1. A method of making an inkjet print head comprising:
forming, by sawing with a rotary saw blade, a first plurality of discontinuous slotted recesses in a first surface of a wafer along a first parallel path of a plurality thereof of the rotary saw blade so that the first plurality of discontinuous slotted recesses are aligned along the first parallel path; and
forming, by sawing with the rotary saw blade, a second plurality of discontinuous slotted recesses in a second surface of the wafer along a second parallel path of a plurality thereof of the rotary saw blade so that second plurality of discontinuous slotted recesses are aligned along the second parallel path and coupled in communication with the first plurality of discontinuous slotted recesses to define a plurality of through-wafer channels.

2. The method of claim 1 , wherein the first and second plurality of discontinuous slotted recesses are formed to have a same depth into the wafer.

3. The method of claim 1 , wherein the first plurality of discontinuous slotted recesses are formed to have a depth into the wafer greater than a depth of the second plurality of discontinuous slotted recesses.

4. The method of claim 1 , wherein the first and second plurality of discontinuous slotted recesses are formed by making overlapping cuts into the wafer with the rotary saw blade.

5. The method of claim 1 , further comprising forming a plurality of inkjet heaters and control circuitry on the wafer.

6. The method of claim 1 , further comprising forming at least one layer on the wafer to define a plurality of inkjet chambers.

7. The method of claim 6 , wherein the at least one layer has a plurality of inkjet orifices formed therein.

8. The method of claim 1 , wherein the wafer comprises a silicon wafer.

9. A method of making an inkjet print head comprising:
forming, by sawing with a rotary saw blade, a first plurality of discontinuous slotted recesses in a first surface of a silicon wafer along a first parallel path of a plurality thereof of the rotary saw blade so that the first plurality of discontinuous slotted recesses are aligned along the first parallel; and
forming, by sawing with the rotary saw blade, a second plurality of discontinuous slotted recesses in a second surface of the silicon wafer along a second parallel path of a plurality thereof of the rotary saw blade so that second plurality of discontinuous slotted recesses are aligned along the second parallel path and coupled in communication with the first plurality of continuous slotted recesses to define a plurality of through-wafer channels;
the first and second plurality of discontinuous slotted recesses being formed by making overlapping cuts into the silicon wafer with the rotary saw blade.

10. The method of claim 9 , wherein the first plurality of discontinuous slotted recesses are formed to have a depth into the wafer greater than a depth of the second plurality of discontinuous slotted recesses.

11. The method of claim 9 , further comprising forming a plurality of inkjet heaters and control circuitry on the silicon wafer.

12. The method of claim 9 , further comprising forming at least one layer on the wafer to define a plurality of inkjet chambers.

13. The method of claim 12 , wherein the at least one layer has a plurality of inkjet orifices formed therein.

14. A method of making an inkjet print head comprising:
forming, by sawing with a rotary saw blade, a first plurality of discontinuous slotted recesses in a first surface of and partly through a wafer along a first parallel path of a plurality thereof of the rotary saw blade so that the first plurality of discontinuous slotted recesses are aligned along the first parallel path; and
forming, by sawing with the rotary saw blade, a second plurality of discontinuous slotted recesses in a second surface of and partly through the wafer along a second parallel path of a plurality thereof of the rotary saw blade so that second plurality of discontinuous slotted recesses are aligned along the second parallel path and coupled in communication with the first plurality of discontinuous slotted recesses to define a plurality of through-wafer channels.

15. The method of claim 14 , wherein the first and second plurality of discontinuous slotted recesses are formed to have a same depth into the wafer.

16. The method of claim 14 , wherein the first plurality of discontinuous slotted recesses are formed to have a depth into the wafer greater than a depth of the second plurality of discontinuous slotted recesses.

17. The method of claim 14 , wherein the first and second plurality of discontinuous slotted recesses are formed by making overlapping cuts into the wafer with the rotary saw blade.

18. The method of claim 14 , further comprising forming a plurality of inkjet heaters and control circuitry on the wafer.

19. The method of claim 14 , further comprising forming at least one layer on the wafer to define a plurality of inkjet chambers.

20. The method of claim 19 , wherein the at least one layer has a plurality of inkjet orifices formed therein.

21. The method of claim 14 , wherein the wafer comprises a silicon wafer.

Assignees

• St Microelectronics Inc

Inventors

• Stewart Kenneth J

Classifications

• B41J2/162

  Manufacturing of the nozzle plates · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• B41J2/1635

  dividing the wafer into individual chips · CPC title

• B41J2/1603

  of the front shooter type · CPC title

• Y10T29/49798

  Dividing sequentially from leading end, e.g., by cutting or breaking · CPC title