Method of tip shape of cutting member, semiconductor chip manufacturing method, circuit board, and electronic apparatus

US9508595B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9508595-B2
Application numberUS-201514927845-A
CountryUS
Kind codeB2
Filing dateOct 30, 2015
Priority dateJul 1, 2013
Publication dateNov 29, 2016
Grant dateNov 29, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A design method includes a process of preparing plural cutting members having different degrees of taper in a tip portion thereof, a process of preparing plural grooves on a front surface side having the same shape, a process of confirming a breakage status when a groove on a rear surface side is formed by the plural cutting members, and a process of selecting, when it is confirmed that both of a cutting member that causes breakage and a cutting member that does not cause the breakage are included, the degree of taper of the cutting member that does not cause the breakage as a tip shape of a cutting member to be used in a mass production process.

First claim

Opening claim text (preview).

What is claimed is: 1. A design method of a tip shape of a cutting member used in a semiconductor piece manufacturing method including forming a groove on a front surface side on a front surface of a substrate, and forming a groove on a rear surface side that communicates with the groove on the front surface side by a rotating cutting member that has a thickness larger than the width of the groove on the front surface side from a rear surface of the substrate and individualizing…

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What does patent US9508595B2 cover?
A design method includes a process of preparing plural cutting members having different degrees of taper in a tip portion thereof, a process of preparing plural grooves on a front surface side having the same shape, a process of confirming a breakage status when a groove on a rear surface side is formed by the plural cutting members, and a process of selecting, when it is confirmed that both of…
Who is the assignee on this patent?
Fuji Xerox Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P54/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).