Deposition device

Patent metadata

Field	Value
Publication number	US-9404180-B2
Application number	US-201113634314-A
Country	US
Kind code	B2
Filing date	Mar 8, 2011
Priority date	Mar 16, 2010
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

The disclosed deposition device for forming a thin film using a starter gas comprising an organic metal compound is provided with: a processing container 22 ; a mounting platform 28 which has a heater 34 for heating the workpiece W; a gas introduction mechanism 80 which introduces the starter gas toward the area more exterior than the outer peripheral end of the workpiece W on the mounting platform 28 ; an internal partition wall 90 which is disposed such that the lower end of said processing space contacts the mounting platform 28 to form gas outlets 92 between the lower portion of the space and the edges of the mounting platform 28 ; and a orifice forming member 96 which extends radially inward toward the mounting platform 28 and forms an orifice 98 communicating with the gas outlet 92.

First claim

What is claimed is:

1. A deposition device comprising:
a processing container configured to accommodate a workpiece and be vacuum exhaustible in order to form a thin film on a surface of the workpiece using a source gas including an organometallic compound;
a mounting platform accommodated in the processing container and configured to mount the workpiece, the mounting platform being equipped with a heater for heating the workpiece;
a gas introduction mechanism including a baffle plate disposed above the mounting platform to be opposed thereto and configured to introduce the source gas toward an area further outside than an outer peripheral end of the workpiece on the mounting platform;
an internal partition wall that surrounds a processing space above the mounting platform to form a boundary for the processing space and installed such that a lower end portion of the internal partition wall comes close to the mounting platform to form a gas outlet between the lower end portion of the internal partition wall and a peripheral edge of a top surface of the mounting platform; and
an orifice forming member installed on the lower end portion of the internal partition wall surrounding the processing space to extend toward a central portion of the processing space to form an orifice communicating with the gas outlet between the internal partition wall and the peripheral edge of the top surface of the mounting platform.

2. The deposition device of claim 1 , wherein a horizontal distance between an inner peripheral end of the orifice forming member and an outer peripheral end of the workpiece mounted on the mounting platform is 0 mm to 10 mm.

3. The deposition device of claim 1 , wherein the internal partition wall and the orifice forming member are maintained at a temperature less than a decomposition temperature of the source gas and equal to or higher than a solidification temperature or a liquefaction temperature.

4. The deposition device of claim 1 , wherein the gas introduction mechanism includes;
a gas discharge port formed at a location corresponding to area further outside than the outer peripheral end of the workpiece mounted on the mounting platform in the peripheral edge of the baffle plate.

5. The deposition device of claim 1 , wherein the peripheral edge of the mounting platform is maintained at a temperature lower than a decomposition temperature of the source gas and equal to or higher than a solidification temperature or a liquefaction temperature.

6. The deposition device of claim 1 , wherein the organometallic compound is made of a material selected from a group consisting of Ru 3 (CO) 12 , W(CO) 6 , Ni(CO) 4 , Mo(CO) 6 , CO 2 (CO) 8 , Rh 4 (CO) 12 , Re 2 (CO) 10 , Cr(CO) 6 , Os 3 (CO) 12 , Ta(CO) 5 , tetrakisethylmethylaminotitanium (TEMAT), TAIMATA, Cu(EDMDD) 2 , TaCl 5 , Trimethylaluminium(TMA), tert-butylimido tris(diethylamido)tantalum (TBTDET), PentaEthoxyTantalum (PET), Tetramethylsilane (TMS), tetrakisethoxyhafnium (TEH), Cp 2 Mn[═Mn(C 5 H 5 ) 2 ], (MeCp) 2 Mn[═Mn(CH 3 C 5 H 4 ) 2 ], (EtCp) 2 Mn[═Mn(C 2 H 5 C 5 H 4 ) 2 ], (i-PrCp) 2 Mn[═Mn(C 3 H 7 C 5 H 4 ) 2 ], MeCpMn(CO) 3 [═(CH 3 C 5 H 4 )Mn(CO) 3 ], (t-BuCp) 2 Mn[═Mn(C 4 H 9 C 5 H 4 ) 2 ], CH 3 Mn(CO) 5 , Mn(DPM) 3 [═Mn(C 11 H 19 O 2 ) 3 ], Mn(DMPD)(EtCp)[═Mn(C 7 H 11 C 2 H 5 C 5 H 4 )], Mn(acac) 2 [═Mn(C 5 H 7 O 2 ) 2 ], Mn(DPM) 2 [═Mn(C 11 H 19 O 2 ) 2 ], Mn(acac) 3 [═Mn(C 5 H 7 O 2 ) 3 ].

Assignees

• Hara Masamichi
• Yamamoto Kaoru
• Gomi Atsushi
• Taga Satoshi
• Tokyo Electron Ltd

Inventors

• Hara Masamichi
• Yamamoto Kaoru
• Gomi Atsushi
• Taga Satoshi

Classifications

• H10P14/43

  Chemical deposition, e.g. chemical vapour deposition [CVD] · CPC title

• H10P14/42 Primary

  using a gas or vapour · CPC title

• C23C16/4412

  Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps · CPC title

• C23C16/455 Primary

  characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber · CPC title

• C23C16/16

  from metal carbonyl compounds · CPC title