Edge ring arrangement with moveable edge rings
US-2024355667-A1 · Oct 24, 2024 · US
Plasma processing apparatus
US9401286B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9401286-B2 |
| Application number | US-201313938347-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 10, 2013 |
| Priority date | Oct 12, 2007 |
| Publication date | Jul 26, 2016 |
| Grant date | Jul 26, 2016 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on the upper surface of adhesive sheet held by a holder frame, is mounted on a stage. In a vacuum chamber that covers the stage therein, plasma is generated, by which the wafer mounted on the stage undergoes plasma treatment. The plasma processing device contains a cover member made of dielectric material. During the plasma treatment on the wafer, the holder frame is covered with a cover member placed at a predetermined position above the stage, at the same time, the wafer is exposed from an opening formed in the center of the cover member.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for performing plasma processing on a wafer, the wafer being attached on an upper surface of an adhesive sheet held by a holder frame supporting a periphery of the adhesive sheet, the method comprising steps of: mounting the wafer attached to the adhesive sheet on a stage disposed in a vacuum chamber; covering the holder frame with a cover member; and supplying gas to the vacuum chamber and generating plasma in the vacuum chamber, wherei…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9401286B2 cover?
- Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on the upper surface of adhesive sheet held by a holder frame, is mounted on a stage. In a vacuum chamber that covers the stage therein, plasma is generated, by which the wafer mounted on the stage undergoes plasma treatment. The plasma proce…
- Who is the assignee on this patent?
- Panasonic Corp, Panasonic Ip Man Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0421. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).