Shielded lid heater assembly

Patent metadata

Field	Value
Publication number	US-9362148-B2
Application number	US-201313793501-A
Country	US
Kind code	B2
Filing date	Mar 11, 2013
Priority date	Mar 21, 2008
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

A shielded lid heater lid heater suitable for use with a plasma processing chamber, a plasma processing chamber having a shielded lid heater and a method for plasma processing are provided. The method and apparatus enhances positional control of plasma location within a plasma processing chamber, and may be utilized in etch, deposition, implant, and thermal processing systems, among other applications where the control of plasma location is desirable. In one embodiment, a shielded lid heater is provided that includes an aluminum base and RF shield sandwiching a heater element.

First claim

What is claimed is:

1. A plasma processing chamber comprising:
a chamber body;
a lid enclosing an interior volume of the chamber body;
a substrate support disposed in the interior volume;
coils positioned adjacent the lid for coupling RF power to gases within the chamber body; and
a shielded lid heater coupled to the lid, wherein the lid heater further comprises:
a thermally conductive base disposed in contact with the lid;
a heater element; and
an RF shield sandwiching the heater element with the thermally conductive base, wherein the thermally conductive base of the shielded lid heater, further comprises: a first section and a second section, wherein the first and second sections of the thermally conductive base include a plurality of fingers forming a spoke-like pattern.

2. The plasma processing chamber of claim 1 , wherein the shielded lid heater further comprises:
an inductor coil coupled to the thermally conductive base.

3. The plasma processing chamber of claim 2 , wherein the inductor coil is repositionable along the thermally conductive base.

4. The plasma processing chamber of claim 2 , wherein the inductor coil is a variable inductor.

5. The plasma processing chamber of claim 1 , wherein the thermally conductive base comprises:
a channel housing the heater element.

6. The plasma processing chamber of claim 1 , wherein the heater element comprises:
a first heater circuit disposed on a first section of the thermally conductive base; and

a second heater circuit disposed on a second section of the thermally conductive base, wherein the first and second heater circuits are coupled by a connector bridging the first and second sections of the thermally conductive base.

7. The plasma processing chamber of claim 1 , wherein the plurality of fingers forming a spoke-like pattern comprises:
interleaved fingers of different length.

8. A plasma processing chamber comprising:
a chamber body;
a lid enclosing an interior volume of the chamber body;
a substrate support disposed in the interior volume;
coils positioned adjacent the lid for coupling RF power to gases within the chamber body; and
a shielded lid heater coupled to the lid, wherein the lid heater further comprises:
a plurality of fingers forming a spoke-like pattern; and
an RF shield disposed on the fingers.

9. The plasma processing chamber of claim 8 , wherein the shielded lid heater further comprises:
a first heater circuit configured to heat a first section of a thermally conductive base; and

a second heater circuit configured to heat a second section of the thermally conductive base, wherein the first and second heater circuits are coupled by a connector bridging the first and second sections of the thermally conductive base.

10. The plasma processing chamber of claim 9 , wherein the shielded lid heater further comprising:
a thermal insulator disposed on the RF shield.

11. The plasma processing chamber of claim 9 , wherein the plurality of fingers forming a spoke-like pattern comprises:
interleaved fingers of different length.

12. The plasma processing chamber of claim 9 , wherein the
first section is separate and disconnectable from the second section.

13. The plasma processing chamber of claim 9 , wherein the shielded lid heater further comprises:
an inductor coil.

14. The plasma processing chamber of claim 13 , wherein the inductor coil is repositionable along the thermally conductive base supporting the fingers.

15. The plasma processing chamber of claim 13 , wherein the inductor coil is a variable inductor.

Assignees

• Willwerth Michael D
• Palagashvili David
• Todorow Valentin N
• Yuen Stephen
• Applied Materials Inc

Inventors

• Willwerth Michael D
• Palagashvili David
• Todorow Valentin N
• Yuen Stephen

Classifications

• H10P72/0421

  for drying etching · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H05B6/108

  for heating a fluid · CPC title

• H01L21/67017

  Electricity · mapped topic

• H01L21/67069 Primary

  Electricity · mapped topic