Printed circuit board, and method for manufacturing printed circuit board

Patent metadata

Field	Value
Publication number	US-9357660-B2
Application number	US-201314067080-A
Country	US
Kind code	B2
Filing date	Oct 30, 2013
Priority date	Oct 30, 2012
Publication date	May 31, 2016
Grant date	May 31, 2016

Abstract

A printed wiring board includes a core substrate having opening, an electronic component device accommodated in the opening of the substrate and including inductor and passive components, a wiring structure connecting the inductor and passive components in the electronic device, a filler resin body filling space formed between the substrate and electronic device in the opening of the substrate, a first buildup layer including a first interlayer insulation layer on first surface of the substrate, a first conductive layer on the first insulation layer, and a first via conductor in the first insulation layer, and a second buildup layer including a second interlayer insulation layer on second surface of the substrate on the opposite side of the first surface of the substrate, a second conductive layer on the second insulation layer, and a second via conductor in the second insulation layer.

First claim

What is claimed is:

1. A printed circuit board, comprising:
a core substrate;
an electronic component device comprising an inductor component and a passive component forming a low pulse filter for an IC chip such that the low pulse filter is accommodated in a single opening portion formed in the core substrate;
a wiring structure connecting the inductor component and the passive component in the electronic component device;
a filler resin body filling a space formed between the core substrate and the electronic component device positioned in the opening portion of the core substrate;
a first buildup layer comprising a first interlayer resin insulation layer formed on a first surface of the core substrate, a first conductive layer formed on the first interlayer resin insulation layer, and a first via conductor formed in the first interlayer resin insulation layer; and
a second buildup layer comprising a second interlayer resin insulation layer formed on a second surface of the core substrate on an opposite side with respect to the first surface of the core substrate, a second conductive layer formed on the second interlayer resin insulation layer, and a second via conductor formed in the second interlayer resin insulation layer,
wherein the wiring structure comprises a connection circuit portion formed on the first interlayer resin insulation layer and a plurality of connection via conductors formed through the first interlayer resin insulation layer and connected to the connection circuit portion such that a first connection via conductor of the connection via conductors is connected to an output electrode of the inductor component and a second connection via conductor of the connection via conductors is connected to a power source electrode of the passive component.

2. The printed circuit board according to claim 1 , wherein the passive component includes one of a capacitor component and a resistor component.

3. The printed circuit board according to claim 1 , wherein the inductor component of the electronic component device comprises a plurality of coil layers and a plurality of resin insulation layers such that the coil layers and the resin insulation layers are alternately laminated.

4. The printed circuit board according to claim 1 , wherein the inductor component comprises a plurality of coil layers, a resin insulation layer interposed between the coil layers, and a via conductor formed in the resin insulation layer such that the via conductor is connecting the coil layers.

5. The printed circuit board according to claim 1 , wherein the filler resin body includes magnetic particles.

6. The printed circuit board according to claim 1 , wherein the passive component of the electronic component device is a capacitor component.

7. The printed circuit board according to claim 1 , wherein the electronic component device comprises the inductor component, the passive component and a resin body integrating the inductor component and the passive component.

8. The printed circuit board according to claim 1 , wherein the wiring structure has a wiring length extending between the output electrode of the inductor component and the power source electrode of the passive component such that the wring length of the wiring structure is 500 μm or less.

9. The printed circuit board according to claim 3 , wherein the plurality of resin insulation layers in the inductor component includes magnetic particles.

10. The printed circuit board according to claim 3 , wherein the passive component of the electronic component device is a capacitor component.

11. The printed circuit board according to claim 4 , wherein the inductor component includes a magnetic layer interposed between the resin insulation layer and one of the coil layers, and the magnetic layer has an aperture portion surrounding the via conductor.

12. The printed circuit board according to claim 6 , wherein the wiring structure has a wiring length extending between the output electrode of the inductor component and the power source electrode of the passive component such that the wring length of the wiring structure is 500 μm or less.

13. The printed circuit board according to claim 11 , wherein the magnetic layer of the inductor component comprises a resin material and magnetic particles.

14. The printed circuit board according to claim 10 , wherein the wiring structure has a wiring length extending between the output electrode of the inductor component and the power source electrode of the passive component such that the wring length of the wiring structure is 500 μm or less.

15. A method for manufacturing a printed circuit board, comprising:
accommodating an electronic component device comprising an inductor component and a passive component forming a low pulse filter for an IC chip such that the low pulse filter is accommodated in a single opening portion formed in an insulation substrate;
filling a filler resin material in a space formed between the insulation substrate and the electronic component device positioned in the opening portion of the insulation substrate such that a filler resin body is formed in the space between the insulation substrate and the electronic component device in the opening portion of the insulation substrate;
forming on a first surface of the insulation substrate a first buildup layer comprising a first interlayer resin insulation layer, a first conductive layer formed on the first interlayer resin insulation layer, and a first via conductor formed in the first interlayer resin insulation layer; and
forming on a second surface of the core substrate on an opposite side with respect to the first surface of the insulation substrate a second buildup layer comprising a second interlayer resin insulation layer, a second conductive layer formed on the second interlayer resin insulation layer, and a second via conductor formed in the second interlayer resin insulation layer,
wherein the forming of the first buildup layer comprises forming a wiring structure comprising a connection circuit portion formed on the first interlayer resin insulation layer and a plurality of connection via conductors formed through the first interlayer resin insulation layer and connected to the connection circuit portion such that a first connection via conductor of the connection via conductors is connected to an output electrode of the inductor component and a second connection via conductor of the connection via conductors is connected to a power source electrode of the passive component.

16. The method for manufacturing a printed circuit board according to claim 15 , wherein the inductor component comprises a plurality of resin insulation layers and a plurality of coil layers formed on the resin insulation layers, respectively, and the passive component is a capacitor component.

17. The method for manufacturing a printed circuit board according to claim 15 , wherein the passive component in the electronic component device is a capacitor component.

18. The method for manufacturing a printed circuit board according to claim 15 , wherein the wiring structure is formed such that the wiring structure has a wiring length extending between the output electrode of the inductor component and the power source electrode of the passive component and that the wiring length of the wiring structure is 500 μm or less.

Assignees

• Ibiden Co Ltd

Inventors

• Yoshikawa Kazuhiro
• Chen Liyi
• Furutani Toshiki

Classifications

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/635

  Through-vias · CPC title

• H10W70/614

  the multiple chips being integrally enclosed · CPC title

• H10W70/611

  for connecting multiple chips together · CPC title

• H05K1/185

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title