Current sensor for a printed circuit board
US-2024237215-A1 · Jul 11, 2024 · US
Wiring board with built-in electronic component
US9220168B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9220168-B2 |
| Application number | US-201414168414-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 30, 2014 |
| Priority date | Feb 5, 2013 |
| Publication date | Dec 22, 2015 |
| Grant date | Dec 22, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 μm and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 μm and accommodated in the cavity of the core substrate, and a laminated structure formed on the surface of the core substrate and including an insulation resin layer and a wiring layer such that the laminated structure is covering the opening of the cavity of the core substrate and the electronic component accommodated in the cavity of the core substrate. The electronic component has an insulation material body and an electrode formed on a surface of the insulation material body, and the wiring layer of the laminated structure is formed such that the thickness of the wiring layer is set smaller than the thickness of the electrode.
First claim
Opening claim text (preview).
What is claimed is: 1. A wiring board with a built-in electronic component, comprising: a core substrate having a thickness not exceeding 300 μm and having a cavity having an opening on a surface of the core substrate and a second opening on a second surface on an opposite side of the core substrate with respect to the surface; an electronic component having a thickness not exceeding 300 μm and accommodated in the cavity of the core substrate; a laminated structure formed on…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K1/185Primary
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9220168B2 cover?
- A wiring board with a built-in electronic component includes a core substrate having the thickness not exceeding 300 μm and having a cavity having an opening on a surface of the core substrate, an electronic component having the thickness not exceeding 300 μm and accommodated in the cavity of the core substrate, and a laminated structure formed on the surface of the core substrate and including…
- Who is the assignee on this patent?
- Ibiden Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K1/185. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 22 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).