Resist mask processing method using hydrogen containing plasma

Patent metadata

Field	Value
Publication number	US-9337020-B2
Application number	US-201314403794-A
Country	US
Kind code	B2
Filing date	Jun 17, 2013
Priority date	Jun 25, 2012
Publication date	May 10, 2016
Grant date	May 10, 2016

Abstract

A method for processing a resist mask includes: (a) a step of preparing, in a processing chamber, a target object to be processed having a patterned resist mask provided thereon; and (b) a step of generating a plasma of the hydrogen-containing gas by supplying a hydrogen-containing gas and supplying a microwave into the processing chamber. The hydrogen-containing gas may be, e.g., H 2 gas.

First claim

What is claimed is:

1. A resist mask processing method comprising:
preparing, in a processing chamber, a target object on which a patterned resist mask is formed; and
curing the patterned resist mask by generating a plasma of a hydrogen-containing gas by supplying the hydrogen-containing gas and supplying a microwave into the processing chamber,
wherein the method further comprises, before said generating the plasma of the hydrogen-containing gas, generating a plasma of a fluorine-containing gas by supplying a fluorine-containing gas and supplying the microwave into the processing chamber where the target object is accommodated.

2. The method of claim 1 , wherein the fluorine-containing gas is CH 3 F gas.

3. The method of claim 1 , wherein said generating the plasma of the fluorine-containing gas suppresses shrinkage of a line of the patterned resist mask in a lengthwise direction of the line of the patterned resist mask.

4. The method of claim 1 , wherein the hydrogen-containing gas is H 2 gas.

5. The method of claim 1 , wherein the plasma of the hydrogen-containing gas which is excited by the microwave disconnects a side chain of a material forming the patterned resist mask while suppressing disconnection of C—C bond of a main chain of the material forming the patterned resist mask.

6. The method of claim 1 , wherein the microwave is generated by a microwave generator coupled to the processing chamber.

7. The method of claim 1 , further comprising, processing the target object using the fluorine gas excited by the microwave to deposit a fluorine compound on the patterned resist mask.

8. A method for manufacturing a semiconductor device comprising:
preparing, in a processing chamber, a target object on which a laminated body is formed, wherein a patterned resist mask is formed on the laminated body;
generating a plasma of a hydrogen-containing gas by supplying the hydrogen-containing gas and supplying a microwave into the processing chamber to thereby cure the patterned resist mask;
etching the laminated body through the cured resist mask to thereby form a patterned hard mask;
removing the cured resist mask; and
etching the target object through the patterned hard mask,
wherein the method further comprises, before said generating the plasma of the hydrogen-containing gas, generating a plasma of a fluorine-containing gas by supplying a fluorine-containing gas and supplying the microwave into the processing chamber where the target object is accommodated.

9. The method of claim 8 , wherein the fluorine-containing gas is CH 3 F gas.

10. The method of claim 8 , wherein said generating the plasma of the fluorine-containing gas suppresses shrinkage of a line of the patterned resist mask in a lengthwise direction of the line of the patterned resist mask.

11. The method of claim 8 , wherein the hydrogen-containing gas is H 2 gas.

12. The method of claim 8 , wherein the plasma of the hydrogen-containing gas which is excited by the microwave disconnects a side chain of a material forming the patterned resist mask while suppressing disconnection of C—C bond of a main chain of the material forming the patterned resist mask.

13. The method of claim 8 , wherein the microwave is generated by a microwave generator coupled to the processing chamber.

14. The method of claim 8 , further comprising, processing the target object using the fluorine gas excited by the microwave to deposit a fluorine compound on the patterned resist mask.

15. The method of claim 1 , wherein at least a portion of the patterned resist mask remains after the curing is performed.

Assignees

• Tokyo Electron Ltd

Inventors

• TAKACHI Michihisa
• Shimizu Yusuke
• Ozu Toshihisa

Classifications

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P76/405 Primary

  characterised by their composition, e.g. multilayer masks · CPC title

• H10P76/204

  of organic photoresist masks · CPC title

• H10P50/642

  Chemical etching · CPC title

• H10P50/287

  by chemical means · CPC title