Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device

Patent metadata

Field	Value
Publication number	US-9329475-B2
Application number	US-201414283274-A
Country	US
Kind code	B2
Filing date	May 21, 2014
Priority date	Oct 23, 2013
Publication date	May 3, 2016
Grant date	May 3, 2016

Abstract

Disclosed are a positive photosensitive resin composition including (A) a polybenzoxazole precursor including a functional group at a terminal end thereof, wherein the functional group is dissociated by light of about 400 nm to about 550 nm wavelength region and is acidified; (B) a photosensitive diazoquinone compound; and (C) a solvent, and a photosensitive resin film and a display device using the same.

First claim

What is claimed is:

1. A positive photosensitive resin composition, comprising:
(A) a polybenzoxazole precursor including a functional group at a terminal end, wherein the functional group is dissociated by light of about 400 nm to about 550 nm wavelength region and is acidified;
(B) a photosensitive diazoquinone compound; and
(C) a solvent,
wherein the functional group is represented by the following Chemical Formula 1:

wherein, in the above Chemical Formula 1,
L 1 and L 2 are the same or different and are each independently a single bond, substituted or unsubstituted C1 to C20 alkylene, substituted or unsubstituted C1 to C20 arylene, substituted or unsubstituted C1 to C20 heteroarylene, or a combination thereof, and
X is substituted or unsubstituted C1 to C20 alkyl, substituted or unsubstituted C2 to C20 alkenyl, substituted or unsubstituted C2 to C20 alkenyl, substituted or unsubstituted C6 to C20 aryl, substituted or unsubstituted C1 to C20 heteroaryl, —C(O)R wherein R is substituted or unsubstituted C1 to C20 aryl, or a combination thereof.

2. The positive photosensitive resin composition of claim 1 , wherein X is selected from one or more of the following Chemical Formula 2 to Chemical Formula 5:

wherein, in the above Chemical Formula 2 to Chemical Formula 5,
R 1 to R 5 are the same or different and are each independently hydrogen, a hydroxy group, a nitro group, substituted or unsubstituted C1 to C10 alkyl, a substituted or unsubstituted C1 to C10 alkoxy group, or a substituted or unsubstituted amino group.

3. The positive photosensitive resin composition of claim 1 , wherein L 1 is represented by the following Chemical Formula 6:

4. The positive photosensitive resin composition of claim 1 , wherein the polybenzoxazole precursor comprises a structural unit represented by the following Chemical Formula 7:

wherein, in the above Chemical Formula 7,
each X 1 is the same or different and each is independently a substituted or unsubstituted C6 to C30 aromatic organic group, and
each Y 1 is the same or different and each is independently a substituted or unsubstituted C6 to C30 aromatic organic group, a substituted or unsubstituted divalent to hexavalent C1 to C30 aliphatic organic group, or a substituted or unsubstituted divalent to hexavalent C3 to C30 alicyclic organic group.

5. The positive photosensitive resin composition of claim 1 , wherein the positive photosensitive resin composition further comprise a dissolution-controlling agent represented by the following Chemical Formula 8:

wherein, in the above Chemical Formula 8,
each R 61 is independently hydrogen, a hydroxy group, or substituted or unsubstituted C1 to C10 alkyl, and
R 62 to R 64 are the same or different and are each independently substituted or unsubstituted C1 to C10 alkyl.

6. The positive photosensitive resin composition of claim 1 , wherein the positive photosensitive resin composition comprises:
about 5 to about 100 parts by weight of the photosensitive diazoquinone compound (B); and
about 100 to about 900 parts by weight of the solvent (C)
each based on about 100 parts by weight of the polybenzoxazole precursor (A).

7. The positive photosensitive resin composition of claim 1 , wherein the positive photosensitive resin composition further comprises an additive including a surfactant, a leveling agent, a silane coupling agent, a thermal acid generator, or a combination thereof.

8. A resin film pattern formed by the process of coating the positive photosensitive resin composition of claim 1 on a substrate to form a photosensitive resin composition layer; exposing the photosensitive resin composition layer; and developing the exposed photosensitive resin composition layer to make the resin film pattern.

9. A display device comprising the resin film pattern of claim 8 .

Assignees

• Cheil Ind Inc

Inventors

• Namgung Ran
• Kwon Hyo-Young
• Cheon Hwan-Sung

Classifications

• C08G69/26

  derived from polyamines and polycarboxylic acids · CPC title

• G03F7/039

  Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title

• C08G73/22

  Polybenzoxazoles · CPC title

• G03F7/023 Primary

  Macromolecular quinonediazides; Macromolecular additives, e.g. binders {(G03F7/0226 takes precedence)} · CPC title

• G03F7/0226 Primary

  characterised by the non-macromolecular additives · CPC title