Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device

Patent metadata

Field	Value
Publication number	US-9405188-B2
Application number	US-201414445567-A
Country	US
Kind code	B2
Filing date	Jul 29, 2014
Priority date	Dec 19, 2013
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

Disclosed is a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a cross-linking agent; (D) a thermal acid generator; (E) a phenol compound; and (F) an organic solvent, wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 1:50 to about 50:1.

First claim

What is claimed is:

1. A positive photosensitive resin composition, comprising:
(A) an alkali soluble resin;
(B) a photosensitive diazoquinone compound;
(C) a cross-linking agent;
(D) a thermal acid generator;
(E) a phenol compound; and
(F) an organic solvent,
wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 5:20 to about 20:5, and
wherein the thermal acid generator comprises one or more compounds represented by the following Chemical Formulae 45 to 48:

2. The positive photosensitive resin composition of claim 1 , wherein the cross-linking agent is a melamine-based cross-linking agent, a methylol-based cross-linking agent, or a combination thereof.

3. The positive photosensitive resin composition of claim 1 , wherein the alkali soluble resin is a polybenzoxazole precursor, a polyimide precursor, or a combination thereof.

4. The positive photosensitive resin composition of claim 3 , wherein the polybenzoxazole precursor comprises a structure unit represented by the following Chemical Formula 1, and the polyimide precursor comprises a structure unit represented by the following Chemical Formula 2:

wherein, in the above Chemical Formulae 1 and 2,
each X 1 is the same or different and each is independently a substituted or unsubstituted C6 to C30 aromatic organic group,
each X 2 is the same or different and each is independently a substituted or unsubstituted C6 to C30 aromatic organic group, a substituted or unsubstituted divalent to hexavalent C1 to C30 aliphatic organic group, or a substituted or unsubstituted divalent to hexavalent C3 to C30 alicyclic organic group,
each Y 1 is the same or different and each is independently a substituted or unsubstituted C6 to C30 aromatic organic group, a substituted or unsubstituted divalent to hexavalent C1 to C30 aliphatic organic group, or a substituted or unsubstituted divalent to hexavalent C3 to C30 alicyclic organic group, and
each Y 2 is the same or different and each is independently a substituted or unsubstituted C6 to C30 aromatic organic group, a substituted or unsubstituted quadrivalent to hexavalent C1 to C30 aliphatic organic group, or a substituted or unsubstituted quadrivalent to hexavalent C3 to C30 alicyclic organic group.

5. The positive photosensitive resin composition of claim 1 , wherein the thermal acid generator has a decomposition temperature of about 120° C. to about 200° C.

6. The positive photosensitive resin composition of claim 1 , wherein the positive photosensitive resin composition comprises:
about 5 to about 100 parts by weight of the photosensitive diazoquinone compound (B);
about 1 to about 50 parts by weight of the cross-linking agent (C);
about 1 to about 50 parts by weight of the thermal acid generator (D); and
about 1 to about 50 parts by weight of the phenol compound (E),
each based on about 100 parts by weight of the alkali soluble resin (A), and
about 3 to about 30 wt % of the organic solvent (F) based on the total solid amount of the positive photosensitive resin composition.

7. The positive photosensitive resin composition of claim 1 , further comprising a surfactant, a leveling agent, a silane coupling agent, or a combination thereof.

8. A photosensitive resin film manufactured using the positive photosensitive resin composition of claim 1 .

9. A display device comprising the photosensitive resin film of claim 8 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Lee Jong-Hwa
• Kwon Ji-Yun
• Kim Sang-Soo
• Noh Kun-Bae
• Park Eun-Bi
• Baek Jae-Yeol
• Lee Bum-Jin
• Lee Sang-Haeng
• Hwang Eun-Ha

Classifications

• G03F7/023

  Macromolecular quinonediazides; Macromolecular additives, e.g. binders {(G03F7/0226 takes precedence)} · CPC title

• G03F7/0758 Primary

  with silicon- containing groups in the side chains · CPC title

• C08G73/22

  Polybenzoxazoles · CPC title

• G03F7/0233

  characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides · CPC title

• G03F7/0226 Primary

  characterised by the non-macromolecular additives · CPC title