Wafer processing tape

Patent metadata

Field	Value
Publication number	US-9324593-B2
Application number	US-201213342535-A
Country	US
Kind code	B2
Filing date	Jan 3, 2012
Priority date	Sep 14, 2007
Publication date	Apr 26, 2016
Grant date	Apr 26, 2016

Abstract

A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.

First claim

The invention claimed is:

1. A wafer processing tape comprising:
a release film;
an adhesive layer formed on a first surface of the release film and having a predetermined planar shape;
a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion, said label portion having a predetermined planar shape and covering the adhesive layer so that the label portion contacts with the release film around the adhesive layer; and
a colored support member formed at both end portions of the release film in a short side direction of the release film,
wherein said colored support member is formed on an area on the second surface of the release film corresponding to an area on the first surface of the release film between an end portion of the release film and an outside of the adhesive layer, and an outer edge of said colored support member is offset from the end portion of the release film,
wherein said colored support member has a coefficient of linear expansion different from that of the release film by a difference of 250 ppm/° C. or less,
said colored support member has a thickness larger than that of the adhesive layer,
said pressure-sensitive adhesive film includes a pressure-sensitive adhesive layer and a base film,
said base film has a coefficient of static friction different from that of said colored support member by a difference of 0.2 to 2.0, and
said base film is formed of at least one of an α-olefin homopolymer or copolymer or a mixture thereof, polyurethane, a styrene-ethylene-butene and pentane-based copolymer, and a thermoplastic elastomer.

2. The wafer processing tape according to claim 1 , wherein said colored support member is formed continuously along a longitudinal direction of the release film.

3. The wafer processing tape according to claim 1 , wherein said colored support member has a layered structure having two or more layers.

4. The wafer processing tape according to claim 1 , wherein said colored support member is formed of a pressure-sensitive adhesive tape having a pressure-sensitive adhesive applied on a base film formed of polyethylene terephthalate or polyester.

5. The wafer processing tape according to claim 1 , wherein said colored support member has a color in accordance with a type of the wafer processing tape.

6. The wafer processing tape according to claim 1 , wherein said colored support member has a color in accordance with a thickness of the wafer processing tape.

7. The wafer processing tape according to claim 1 , wherein said colored support member is disposed on the second surface of the release film so that the outer edge of said colored support member is situated within an area corresponding to the surrounding portion of the pressure-sensitive adhesive film on the first surface of the release film.

8. The wafer processing tape according to claim 1 , wherein said colored support member is disposed on the second surface of the release film so that an inner edge of said colored support member is situated outside an area corresponding to the surrounding portion of the pressure-sensitive adhesive film on the first surface of the release film.

9. The wafer processing tape according to claim 1 , wherein said colored support member having the coefficient of linear expansion of 300 ppm/° C. or less.

10. The wafer processing tape according to claim 1 , wherein a space is provided between the label portion of the pressure-sensitive adhesive film and the surrounding portion of the pressure-sensitive adhesive film.

Assignees

• Maruyama Hiromitsu
• Sakuma Noboru
• Morishima Yasumasa
• Ishiwata Shinichi
• Furukawa Electric Co Ltd

Inventors

• Maruyama Hiromitsu
• Sakuma Noboru
• Morishima Yasumasa
• Ishiwata Shinichi

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/0442 Primary

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• Y10T428/2878

  including addition polymer from unsaturated monomer · CPC title

• H01L21/6836

  Electricity · mapped topic