Exposure apparatus and exposure method thereof

Patent metadata

Field	Value
Publication number	US-9298099-B2
Application number	US-201314039332-A
Country	US
Kind code	B2
Filing date	Sep 27, 2013
Priority date	Mar 5, 2013
Publication date	Mar 29, 2016
Grant date	Mar 29, 2016

Abstract

An exposure apparatus is provided for performing an unidirectional scan-exposure. The exposure apparatus includes a base and a wafer stage group having a plurality of wafer stages on the base for holding wafers and successively moving from a first position to a second position of the base cyclically. The exposure apparatus also includes an alignment detection unit above the first position for detecting wafer stage fiducials at the first position and alignment marks on a wafer on the wafer stage to align the wafer. Further, the exposure apparatus includes a reticle stage on the second position for loading a cylindrical reticle and causing the cylindrical reticle to rotate around the center axis of the reticle stage and an optical projection unit between the reticle stage and the base for projecting light passing through the cylindrical reticle onto exposure regions on a wafer on the wafer stage.

First claim

What is claimed is:

1. An exposure apparatus, comprising:
a base;
a wafer stage group having a plurality of wafer stages on the base for holding wafers and successively moving from a first position to a second position of the base cyclically;
an alignment detection unit above the first position for detecting wafer stage fiducials on the wafer stage at the first position and alignment marks on a wafer on the wafer stage at the first position to align the wafer;
a reticle stage on the second position for loading a cylindrical reticle and causing the cylindrical reticle to rotate around a center axis of the reticle stage; and
an optical projection unit between the reticle stage and the base for projecting light passing through the cylindrical reticle on exposure regions of a wafer on the wafer stage,
wherein a control system is configured to control the wafer stage group such that:
when the wafer stage moves from the first position to the second position, the wafer stage performs a unidirectional scan along an scanning direction, the cylindrical reticle rotates around the center axis of the reticle stage, the light passing through the cylindrical reticle is projected onto the wafer on the wafer stage, and a column of exposure regions on the wafer along the scanning direction are exposed, and
a first column of exposure regions on a first wafer and a corresponding column of exposure regions on a second wafer are each exposed prior to exposing a second column of the exposure regions on the first wafer.

2. The exposure apparatus according to claim 1 , wherein:
the wafer stages are driven by a magnetic suspension system.

3. The exposure apparatus according to claim 2 , wherein:
each of the wafer stages has a corresponding sub control unit for controlling positioning, moving and alignment of the wafer stage, and for communicating with the magnetic suspension system and the alignment detection unit.

4. The exposure apparatus according to claim 3 , further including:
a main control unit communicating with the wafer stage, the alignment detection unit, the optical projection unit, and the sub control unit, and managing alignment and exposure of the wafer.

5. The exposure apparatus according to claim 4 , wherein:
the sub control unit of the wafer stage communicates with the main control unit by a wireless communication technology.

6. The exposure apparatus according to claim 5 , wherein:
each of the wafer stages has a power storage unit storing power for operating the wafer stage.

7. The exposure apparatus according to claim 6 , wherein the exposure apparatus further includes:
a cable connection unit for forming a detachable connection between a charging cable and the power storage unit for charging the power storage unit when the charging cable and the power storage unit are connected.

8. The exposure apparatus according to claim 7 , wherein:
a fixed or detachable connection is used between the charging cable and the wafer stage when the number of the wafer stage is two; and
the detachable connection is used between the charging cable and the wafer stage when a number of the wafer stages is greater than two.

9. The exposure apparatus according to claim 1 , further including:
a position detection system for detecting the position information of the wafer stage,
wherein:
the position detection system includes the alignment detection unit, an encoder plate between the optical projection unit and the wafer stage, and encoder plate readers on the top surface of the wafer stage.

10. The exposure apparatus according to claim 9 , wherein:
the encoder plate has a plurality of groves and heaves;
a reflection grating is formed by the groves and the heaves with an alternative distribution; and
a surface of the encoder plate having the groves and the heaves faces the top surface of the wafer stage.

11. The exposure apparatus according claim 9 , wherein:
the encoder plate includes a first sub encoder plate and a second sub encoder plate;
the first sub encoder plate and the second sub encoder plate are dissymmetrical; and
a symmetrical line between the first sub encoder plate and the second sub encoder plate and a connecting line between the alignment detection unit and the center of the optical projection unit are in a same plane perpendicular to the base.

12. The exposure apparatus according to claim 9 , wherein:
a width of the encoder plate is greater than a width of the wafer stage;
a length of the encoder plate is greater than a line distance between the alignment detection unit and the center of the optical projection unit;
the encoder plate has a first opening and a second opening;
the first opening is at a position corresponding to the alignment detection unit; and
the second opening is at a position corresponding to the optical projection unit.

13. The exposure apparatus according to claim 9 , wherein:
a surface of the wafer stage has a wafer holding region and a peripheral region surrounding the wafer holding region;
the encoder plate readers are in the peripheral region of the top surface of the wafer stage;
each of the encoder plate readers has two encoder plate readers; and
each of the encoder plate readers has an optical emission unit for emitting light, an optical receiver unit for receiving reflected light from the encoder plate and converting the reflected light to electrical signals, and a recognition unit for obtaining the displacement of the wafer stage by orienting and counting the electrical signals.

14. The exposure apparatus according to claim 13 , wherein:
a number of the encoder plate readers is at least three locating at different positions of the peripheral region of the wafer stage.

15. The exposure apparatus according to claim 13 , wherein:
the encoder plate at a surrounding region of a first opening has zeroing marks;
each of the encoder plate readers has zeroing mark detection units for detecting the zeroing marks;
a number of the zeroing marks is equal to a number of the zeroing mark detection units; and
a distribution of the zeroing marks on the encode plate is same as a distribution of the zeroing mark detection units.

16. The exposure apparatus according to claim 1 , wherein:
the cylindrical reticle is a hollow cylinder;
the surface of the cylindrical reticle has patterns; and
a projected length of the perimeter of the outer surface of the cylindrical reticle projected by the optical projection unit is equal to a length of an exposure area on a wafer, or a total length of a plurality of the exposure regions.

17. The exposure apparatus according to claim 16 , wherein:
the cylindrical reticle has reticle alignment marks;
the wafer stage has reticle alignment sensors; and
the reticle alignment sensors are used to detect the reticle alignment marks to align the cylindrical reticle.

18. An exposure method, comprising:
Step 1, installing wafers successively on a plurality of wafer stages;
Step 2, moving the wafer stages holding the wafers to a first position successively, detecting stage fiducials on the wafer stages and alignment marks on the wafers to align the wafers;
Step 3, moving the wafer stage having the aligned wafer from the first position to a second position and performing an unidirectional scanning along a scanning direction; rotating a cylindrical reticle around a center axis of a reticle stage; projecting light passing through the cylindrical reticle onto the wafers on the wafer stages; and exposing a first column of exposure regions on a first wafer and a c

Assignees

• Semiconductor Mfg Int Shanghai

Inventors

• Wu Qiang
• Zu Yanlei
• Hu Huayong
• Gu Yiming

Classifications

• G03F7/70733 Primary

  Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask · CPC title

• G03F7/70775

  Position control, e.g. interferometers or encoders for determining the stage position · CPC title

• G03F7/703

  Non-planar pattern areas or non-planar masks, e.g. curved masks or substrates · CPC title

• G03F1/00

  Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof · CPC title

• G03F7/70141 Primary

  Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system · CPC title