Substrate treating apparatus and substrate treating method
US-2024030057-A1 · Jan 25, 2024 · US
Apparatus for transferring a substrate in a lithography system
US9176397B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9176397-B2 |
| Application number | US-201213460239-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 30, 2012 |
| Priority date | Apr 28, 2011 |
| Publication date | Nov 3, 2015 |
| Grant date | Nov 3, 2015 |
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Abstract
Official abstract text for this publication.
An apparatus for transferring substrates within a lithography system, the lithography system comprising a substrate preparation unit for clamping a substrate onto a substrate support structure to form a clamped substrate, and an interface with a substrate supply system for receiving unclamped substrates. The apparatus comprises a body provided with a first set of fingers for carrying an unclamped substrate and a second set of fingers for carrying a substrate support structure, and the first set of fingers is located below the second set of fingers, and fingers of the first set of fingers have a different shape than the fingers of the second set of fingers.
First claim
Opening claim text (preview).
The invention claimed is: 1. An apparatus for transferring substrates within a lithography system, the lithography system comprising an interface with a substrate supply system for receiving unclamped substrates and a substrate preparation unit for clamping an unclamped substrate onto a substrate support structure to form a clamped substrate; wherein the apparatus comprises a body, the body provided with a first set of fingers for carrying and transferring an unclamped substrate,…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10P72/0458Primary
Electricity · mapped topic
- G03F7/7075Primary
Physics · mapped topic
- G03F7/70733Primary
Physics · mapped topic
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Frequently asked questions
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- What does patent US9176397B2 cover?
- An apparatus for transferring substrates within a lithography system, the lithography system comprising a substrate preparation unit for clamping a substrate onto a substrate support structure to form a clamped substrate, and an interface with a substrate supply system for receiving unclamped substrates. The apparatus comprises a body provided with a first set of fingers for carrying an unclamp…
- Who is the assignee on this patent?
- Kuiper Vincent Sylvester, Slot Erwin, Van Kervinck Marcel Nicolaas Jacobus, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0458. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).