Method of detecting and measuring contact alignment shift relative to gate structures in a semicondcutor device

Patent metadata

Field	Value
Publication number	US-9269639-B2
Application number	US-201314040730-A
Country	US
Kind code	B2
Filing date	Sep 30, 2013
Priority date	Jun 25, 2013
Publication date	Feb 23, 2016
Grant date	Feb 23, 2016

Abstract

The present invention provides a method of detecting and measuring the alignment shift of the contacts relative to the gate structures. The method comprises: designing a test model array having different test model regions on the substrate; forming second conductivity type doped well regions, gate structures, and first conductivity type doped active regions in each of the test model regions; forming contacts in each of the test model region; scanning the test model array by an electron-beam inspector to obtain light-dark patterns of the contacts; and detecting and measuring the alignment shift of the contacts relative to the gate structures according to the light-dark patterns of the contacts and the critical dimensions of the transistors in the test model regions.

First claim

The invention claimed is:

1. A method of detecting and measuring the alignment shift of contacts relative to the gate structures comprising:
Step S 01 , designing a test model array having different test model regions on the substrate, each of the test model region is designed to form a simulated semiconductor device having multiple first conductivity type transistors of a predetermined critical dimension; the critical dimensions of the transistors differ in different test model regions;
Step S 02 , foaming second conductivity type doped well regions, gate structures of the first conductivity type transistors, and first conductivity type doped active regions in each of the test model regions;
Step S 03 , forming contacts in each of the test model region;
Step S 04 , scanning the test model array by an electron-beam inspector to obtain light-dark patterns of the contacts;
Step S 05 , detecting and measuring the alignment shift of the contacts relative to the gate structures according to the light-dark patterns of the contacts and the critical dimension of the transistors in the test model regions.

2. The method of detecting and measuring the alignment shift of contacts relative to the gate structures according to claim 1 , wherein the test model regions are arranged evenly spaced in the test model array.

3. The method of detecting and measuring the alignment shift of contacts relative to the gate structures according to claim 1 , wherein the contacts comprise contacts formed on the first conductivity type doped active regions between two adjacent gate structures, contacts formed on the gate structures, and shared contacts reaching both the gate structures as well as the first conductivity type doped active regions.

4. The method of detecting and measuring the alignment shift of contacts relative to the gate structures according to claim 1 , wherein the contacts are formed by the following steps: depositing a layer of interlayer dielectric; forming contact holes through lithography and etching process; depositing metals in the contact holes; and performing CMP to remove the metals on the surface of the interlayer dielectric.

5. The method of detecting and measuring the alignment shift of contacts relative to the gate structures according to claim 1 , wherein the landing voltage applied by the electron-beam inspector is 500 eV to 1200 eV; the current applied by the electron-beam inspector is 80 nA to 120 nA.

6. The method of detecting and measuring the alignment shift of contacts relative to the gate structures according to claim 1 , wherein the pixel size of the light-dark patterns scanned by the electron-beam inspector is 30 nm to 100 nm.

7. The method of detecting and measuring the alignment shift of contact relative to the gate structures according to claim 1 , wherein when the transistors are NMOS transistors, the electron-beam inspector is applied in a positive mode; when the transistors are PMOS transistors, the electron-beam inspector is applied in a negative mode.

8. The method of detecting and measuring the alignment shift of contacts relative to the gate structures s according to claim 1 , wherein the layout of the test model region includes well regions separated from each other by isolation regions in which a plurality of active regions and a plurality of gate lines traversing the active regions are formed, wherein the step S 02 further comprises:
Step S 11 : forming a first mask layer on the substrate, and exposing the well regions;
Step S 12 : implanting second conductivity type impurities on the substrate and removing the first mask layer to form the second conductivity type doped well regions;
Step S 13 : forming gate structures of the first conductivity type transistors on the gate lines;
Step S 14 : forming a second mask layer, and exposing the active regions;
Step S 15 : implanting first conductivity type impurities on the substrate and removing the second mask layer to form the first conductivity type doped active regions in the second conductivity type doped well region.

9. The method of detecting and measuring the alignment shift of contacts relative to the gate structures according to claim 8 , wherein the active regions extend in the vertical direction and the gate lines extend in the horizontal direction.

10. The method of detecting and measuring the alignment shift of contacts relative to the gate structures according to claim 1 , wherein the critical dimension of the transistors comprises the space between the adjacent gate structures and the dimension of the contacts.

11. The method of detecting and measuring the alignment shift of contacts relative to the gate structures according to claim 10 , wherein the spaces between the adjacent gate structures of the transistors in the test model regions increase along the horizontal direction of the test model array and equal along the vertical direction; the dimensions of the contacts increase along the vertical direction and equal along the horizontal direction.

Assignees

• Shanghai Huali Microelect Corp

Inventors

• Fan Rongwei
• Liu Feijue
• Long Yin
• Ni Qiliang
• Chen Hunglin

Classifications

• H10P74/27

  Structural arrangements therefor · CPC title

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H01L22/12 Primary

  Electricity · mapped topic