Pedestal with multi-zone temperature control and multiple purge capabilities

Patent metadata

Field	Value
Publication number	US-9267739-B2
Application number	US-201213723516-A
Country	US
Kind code	B2
Filing date	Dec 21, 2012
Priority date	Jul 18, 2012
Publication date	Feb 23, 2016
Grant date	Feb 23, 2016

Abstract

Substrate support assemblies for a semiconductor processing apparatus are described. The assemblies may include a pedestal and a stem coupled with the pedestal. The pedestal may be configured to provide multiple regions having independently controlled temperatures. Each region may include a fluid channel to provide a substantially uniform temperature control within the region, by circulating a temperature controlled fluid that is received from and delivered to internal channels in the stem. The fluid channels may include multiple portions configured in a parallel-reverse flow arrangement. The pedestal may also include fluid purge channels that may be configured to provide thermal isolation between the regions of the pedestal.

First claim

What is claimed is:

1. A substrate support assembly comprising:
a pedestal having a substrate support surface configured to support a substrate during a substrate processing operation; a stem attached to the pedestal opposite the substrate support surface, the stem having a first pair of stem internal channels configured to deliver and receive a first temperature controlled fluid to the pedestal and a second pair of stem internal channels configured to deliver and receive a second temperature controlled fluid to the pedestal;
a first fluid channel within a first region of the pedestal to provide substantially uniform temperature control within the first region, the first fluid channel coupled at a first inlet to receive the first temperature controlled fluid from one of the first pair of stem internal channels, coupled at a first outlet to deliver the first temperature controlled fluid to the other of the first pair of stem internal channels, and including a first portion and a second portion between the inlet and the outlet, wherein the second portion is disposed vertically from and arranged in a parallel-reverse pattern with the first portion such that fluid received at the first inlet flows outwardly through the first portion prior to flowing to an outward section of the second portion and through the second portion inwards to the first outlet; and a second fluid channel within a second region of the pedestal to provide substantially uniform temperature control within the second region, the second fluid channel coupled at a second inlet to receive the second temperature controlled fluid from one of the second pair of stem internal channels, coupled at a second outlet to deliver the second temperature controlled fluid to the other of the second pair of stem internal channels, and including a third portion and a fourth portion between the inlet and the outlet, wherein the third portion is disposed vertically from and arranged in a parallel-reverse pattern with the fourth portion such that fluid received at the second inlet flows outwardly towards an outward section of the third portion prior to flowing to an outward section of the fourth portion and through the fourth portion inwards to the second outlet.

2. The substrate support assembly of claim 1 , wherein the first and second fluid channels are each arranged in a coil pattern.

3. The substrate support assembly of claim 1 , wherein the stem further comprises a heating means operable to maintain a temperature of the stem different from the first and second pedestal regions.

4. The substrate support assembly of claim 1 , wherein the first and second fluid channels are fluidly isolated from each other.

5. The substrate support assembly of claim 1 , wherein the substrate support surface is circular, and wherein the first region is centrally located, and the second region is an annular region surrounding the first region.

6. The substrate support assembly of claim 1 , wherein the pedestal and stem are two separate components electrically isolated from one another.

7. The substrate support assembly of claim 1 , wherein the first and second portion of the first fluid channel are disposed vertically from each other in direct vertical alignment.

8. The substrate support assembly of claim 1 , wherein the third and fourth portion of the second fluid channel are disposed vertically from each other in direct vertical alignment.

9. The substrate support assembly of claim 1 , further comprising a first purge channel defined within the pedestal and configured to provide a first purge flow path for a purge gas, wherein the first purge channel includes a vertical isolation cavity defined between the first region and the second region of the pedestal, and the isolation cavity is configured to receive a portion of the purge gas.

10. The substrate support assembly of claim 9 , wherein the pedestal comprises multiple plates, and wherein:
a first plate comprises the substrate support surface,
at least one plate located below the first plate comprises areas defining the first and second portions of the first fluid channel, at least part of the third and fourth portions of the second fluid channel, at least part of the isolation cavity, and the first purge channel, and
a second plate located below the first plate comprises areas defining at least part of the third and fourth portions of the second fluid channel, and at least part of the isolation cavity.

11. The substrate support assembly of claim 10 , wherein the at least one plate comprises at least two plates including:
a third plate located below the first plate and comprising areas defining at least part of the first and second portions of the first fluid channel, at least part of the third and fourth portions of the second fluid channel, and a first portion of the isolation cavity; and
a fourth plate located below the third plate and comprising areas defining at least a portion of the first purge channel, as well as at least a second portion of the isolation cavity that is in fluid communication with the first portion of the isolation cavity defined by the third plate.

12. The substrate support assembly of claim 9 , wherein the isolation cavity produces a thermal barrier between the first region of the pedestal and the second region of the pedestal.

13. The substrate support assembly of claim 9 , further comprising a second purge channel defined along an interface between the stem and the pedestal, and configured to provide a second purge flow path producing a thermal barrier between the stem and the pedestal.

14. The substrate support assembly of claim 13 , wherein the pedestal further comprises a purge distribution plate at least partially defining the second purge channel.

Assignees

• Applied Materials Inc

Inventors

• Chen Xinglong
• Yang Jang-Gyoo
• Tam Alexander
• Tam Elisha

Classifications

• H10P72/0434 Primary

  mainly by convection · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• F28D15/00 Primary

  Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls {; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies (F28D17/00, F28D19/00, F28D20/00 take precedence)} · CPC title

• H01L21/67109

  Electricity · mapped topic

• H10P72/7611 Primary

  characterised by edge profile or support profile · CPC title