Abrasive article and method of forming

US9248583B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9248583-B2
Application numberUS-201113341862-A
CountryUS
Kind codeB2
Filing dateDec 30, 2011
Priority dateDec 30, 2010
Publication dateFeb 2, 2016
Grant dateFeb 2, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An abrasive article may include a substrate, a tacking film overlying the substrate, abrasive particles that may include a coating layer bonded to the tacking film such that a bond between the coating layer and the tacking film defines a metallic bonding region, and a bonding layer overlying the abrasive particles and the tacking film.

First claim

Opening claim text (preview).

What is claimed is: 1. An abrasive article for cutting a workpiece formed by a process comprising: providing a wire substrate; forming a tacking film comprising a metal material overlying a surface of the wire substrate; placing abrasive particles in the tacking film; treating the tacking film to form a metallic bonding region between the abrasive particles and the tacking film, wherein the tacking film comprises an average thickness of at least about 10% and not greater than about 30% of an average particle size of the abrasive particles and wherein the tacking film comprises an electroplated layer; and forming a bonding layer over the tacking film and the abrasive particles. 2. The abrasive article of claim 1 , wherein the substrate comprises an inorganic material. 3. The abrasive article of claim 2 , wherein the substrate comprises steel. 4. The abrasive article of claim 1 , wherein the substrate comprises an average width of at least about 0.03 mm and not greater than about 1 cm. 5. The abrasive article of claim 1 , wherein the tacking film comprises an average thickness of not greater than about 80% of an average particle size of the abrasive particles. 6. The abrasive article of claim 1 , wherein the metallic bonding region comprises a diffusion bond region characterized by a region of interdiffusion between at least one chemical species of a coating layer overlying the abrasive particles and one chemical species of the tacking film. 7. An abrasive article for cutting a workpiece formed by a process comprising: providing a wire substrate; forming a tacking film comprising a metal material overlying a surface of the wire substrate; applying a flux material to the tacking film, wherein the flux material comprises abrasive particles mixed therein; treating the tacking film to form a metallic bonding region between the abrasive particles and the tacking film, wherein the tacking film comprises an average thickness of at least about 10% and not greater than about 30% of an average particle size of the abrasive particles and wherein the tacking film comprises an average thickness of at least about 0.1 microns and not greater than about 4 microns; and forming a bonding layer over the tacking film and the abrasive particles. 8. The abrasive article of claim 7 , wherein the abrasive particles comprise an average particle size of at least about 0.1 microns and not greater than about 500 microns. 9. The abrasive article of claim 7 , wherein the abrasive particles comprise a superabrasive material. 10. The abrasive article of claim 7 , wherein an average thickness of the bonding layer is at least about 2 microns and not greater than about 100 microns. 11. The abrasive article of claim 7 , wherein the tacking film has a melting point of not greater than about 250° C. 12. The abrasive article of claim 7 , wherein the tacking film comprises a metal alloy of tin and lead. 13. The abrasive article of claim 7 , wherein the substrate comprises a plurality of filaments braided together. 14. The abrasive article of claim 7 , wherein the substrate includes a wire and an abrasive grain concentration of the abrasive article is at least about 60 particles per mm of wire and not greater than about 750 particles per mm of wire. 15. The abrasive article of claim 7 , wherein forming the tacking film comprises a method selected from the group consisting of deposition, spraying, printing, dipping, die coating, electroplating, and a combination thereof. 16. The abrasive article of claim 7 , wherein the tacking film is bonded to the substrate at a bonding region defined by interdiffusion of elements of the tacking film and the substrate. 17. The abrasive article of claim 7 , wherein the tacking film comprises a material selected from the group of materials consisting of metal, metal alloys, metal matrix composites, and a combination thereof. 18. The abrasive article of claim 7 , wherein the tacking film comprises a metal alloy of tin and lead. 19. The abrasive article of claim 7 , wherein the tacking film has a melting point of not greater than about 450° C.

Assignees

Inventors

Classifications

  • Making tools for sawing machines or sawing devices for use in cutting any kind of material · CPC title

  • Constructional features of flexible abrasive materials; Special features in the manufacture of such materials · CPC title

  • metallic {or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements} · CPC title

  • Flexible supporting members, e.g. paper, woven, plastic materials · CPC title

  • using a cutting wire · CPC title

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Frequently asked questions

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What does patent US9248583B2 cover?
An abrasive article may include a substrate, a tacking film overlying the substrate, abrasive particles that may include a coating layer bonded to the tacking film such that a bond between the coating layer and the tacking film defines a metallic bonding region, and a bonding layer overlying the abrasive particles and the tacking film.
Who is the assignee on this patent?
Tian Yinggang, Khaund Arup K, Subramanian Krishnamoorthy, and 3 more
What technology area does this patent fall under?
Primary CPC classification B24B27/0633. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 02 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).