Method of tip shape of cutting member, semiconductor chip manufacturing method, circuit board, and electronic apparatus
US-9508595-B2 · Nov 29, 2016 · US
US9409243B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9409243-B2 |
| Application number | US-201414256209-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 18, 2014 |
| Priority date | Apr 19, 2013 |
| Publication date | Aug 9, 2016 |
| Grant date | Aug 9, 2016 |
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An abrasive article including a substrate as an elongated member, a first layer overlying the substrate, abrasive particles overlying the first layer, fillets connecting the first layer and the abrasive particles, a bonding layer overlying the abrasive particles, the first layer and the fillets, and the fillets have a fillet characteristic relative to an abrasive application, the fillet characteristic selected from the group consisting of tacking factor (t fl /t f ), a fillet-to-particle factor (t f /d ab ), a fillet-to-bonding layer factor (t f /t bl ), a contact factor (A b /A f ), a fillet size variance (V f ), and a combination thereof.
Opening claim text (preview).
What is claimed is: 1. An abrasive article comprising: a substrate comprising an elongated member; a first layer overlying the substrate; abrasive particles overlying the first layer; fillets connecting the first layer and the abrasive particles; and a bonding layer overlying the abrasive particles, wherein the fillets have a tacking factor (t fl /t f ) of at least about 0.1 and not greater than about 2.0, wherein t fl represents an average thickness of the first layer and t f represents an average thickness of the fillets. 2. The abrasive article of claim 1 , wherein the tacking factor (t fl /t f ) is at least about 0.5 and not greater than about 1.5, wherein t fl represents an average thickness of the first layer and t f represents an average maximum thickness of the fillets. 3. An abrasive article comprising: a substrate comprising an elongated member; a first layer overlying the substrate; abrasive particles overlying the first layer; and fillets connecting the first layer and the abrasive particles, wherein the fillets have a tacking factor (t fl /t f ) of at least about 0.1 and not greater than about 2.0, wherein t fl represents an average thickness of the first layer and t f represents an average thickness of the fillets. 4. The abrasive article of claim 3 , wherein the tacking factor (t fl /t f ) is at least about 0.5. 5. The abrasive article of claim 3 , further comprising a fillet-to-particle factor (t f /d ab ) of at least about 0.05 and not greater than about 0.32, wherein t f represents an average maximum thickness of the fillets and d ab represents and an average particle size of the abrasive particles. 6. The abrasive article of claim 3 , further comprising a fillet-to-bonding layer factor (t f /t bl ) of not greater than about 100 and at least about 10, wherein t f represents an average maximum thickness of the fillets and t bl represents and an average thickness of the bonding layer. 7. The abrasive article of claim 3 , further comprising a contact factor (A b /A f ) of at least about 1.0 and not greater than about 10, wherein A b represents an average percentage of a surface area of the abrasive particles in contact with the bonding layer, and A f represents an average percentage of the surface area of the abrasive particles in contact with the fillets. 8. The abrasive article of claim 3 , further comprising a fillet size variance (V f ) of not greater than about 60% and at least about 2%. 9. The abrasive article of claim 3 , wherein the fillets comprise a metal. 10. The abrasive article of claim 3 , wherein the fillets comprise a mixture of a composition of the first layer and an active bonding material. 11. The abrasive article of claim 10 , wherein the fillets comprise at least two discrete phases of material including a first phase and a second phase. 12. The abrasive article of claim 10 , wherein the first phase is preferentially located closer to a surface of the abrasive particles as compared to the second phase. 13. The abrasive article of claim 3 , wherein the fillets comprises at least three discrete phases of material including a first phase, a second phase, and a third phase. 14. The abrasive article of claim 3 , further comprising a filler in the first layer distinct from the abrasive particles, wherein the filler is distinct from the abrasive particles based on at least one filler criteria selected from the group consisting of average particle size, composition, content, concentration, distribution, and a combination thereof. 15. A method of forming an abrasive article comprising: providing a body including abrasive particles overlying a first layer, the first layer overlying a substrate; processing at least the substrate, the first layer, and the abrasive particles according to a controlled processing condition to form an abrasive article having a tacking factor (t fl /t f ) of at least about 0.1 and not greater than about 2.0, wherein t fl represents an average thickness of the first layer and t f represents an average thickness of the fillets; and wherein the controlled processing condition is selected from the group consisting of re-flow temperature, filler content, filler size, filler composition, average particle size of the abrasive particles, size distribution of the abrasive particles, content of the abrasive particles, composition of the abrasive particles, thickness of the first layer, composition of the first layer, and a combination thereof. 16. The method of claim 15 , wherein processing according to the controlled processing condition includes heating the substrate, the first layer, and the abrasive particles to a re-flow temperature. 17. The method of claim 16 , wherein the re-flow temperature is different than a melting temperature by at least about 0.5% based on the equation [(Tm−Tr)/Tm]×100%, wherein Tm represents the melting temperature of the first layer and Tr represents the re-flow temperature. 18. The method of claim 16 , wherein the re-flow temperature is not greater than about 450° C. and at least about 100° C. 19. The method of claim 15 , wherein processing according to the controlled processing condition includes changing a viscosity of the first layer and controlling the wetting of the abrasive particles by the first layer.
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