Printed circuit boards fabricated using congruent molds

Patent metadata

Field	Value
Publication number	US-9247649-B2
Application number	US-201313887807-A
Country	US
Kind code	B2
Filing date	May 6, 2013
Priority date	May 6, 2013
Publication date	Jan 26, 2016
Grant date	Jan 26, 2016

Abstract

Methods for fabricating printed circuit boards, devices for use in the fabrication of printed circuit boards, and structures for a printed circuit board. A mold may be formed as a device that includes a plurality of features, such as recesses, corresponding to a layout of a plurality of conductors for the printed circuit board. A sheet comprised of an electrically-conductive material may be deformed to match the features of the mold. A substrate may then be added to support the sheet, and the sheet may be selectively removed with a mechanical process to define the conductors of the printed circuit board.

First claim

What is claimed is:

1. A method of fabricating a printed circuit board, the method comprising:
obtaining a first mold including a plurality of features that correspond to a layout of a plurality of conductors for the printed circuit board;
deforming a sheet comprised of an electrically-conductive material to match the features of the first mold;
after the sheet is deformed, forming a substrate that is coupled with the sheet; and
removing the substrate and the sheet as an assembly from the first mold.

2. The method of claim 1 wherein the substrate includes a surface and a plurality of recesses in the surface, and the sheet occupies the recesses and covers the surface, and further comprising:
mechanically removing the electrically-conductive material of the sheet from the surface of the substrate to define the conductors in the recesses.

3. The method of claim 2 further comprising:
after the electrically-conductive material of the sheet is mechanically removed from the surface of the substrate, mechanically removing the surface of the substrate to reduce a depth of the recesses relative to the surface of the substrate.

4. The method of claim 3 wherein the depth of the recesses is greater than or equal to a thickness of the sheet.

5. The method of claim 1 wherein forming the substrate that is coupled to the sheet comprises:
applying a liquid resin material in contact with the sheet; and
curing the liquid resin material to form the substrate.

6. The method of claim 1 further comprising:
obtaining a second mold having a plurality of features corresponding in configuration, shape, and arrangement to the features of the first mold.

7. The method of claim 6 wherein deforming the sheet comprised of the electrically-conductive material to match the features of the first mold comprises:
placing the sheet between the first mold and the second mold; and
pressing the second mold against the first mold so that the features of the second mold engage the features of the first mold with the sheet therebetween and the sheet is deformed by the features of the second mold into the features of the first mold.

8. The method of claim 7 further comprising:
before the first mold and the second mold are pressed together, temporarily bonding the sheet to the first mold with an adhesive agent effective to retain the sheet to the first mold when the second mold is separated from the first mold.

9. The method of claim 2 wherein the electrically-conductive material of the sheet is mechanically removed from the surface of the substrate by a mechanical process comprising as sanding, grinding, polishing, or combinations thereof.

10. A method of fabricating a printed circuit board, the method comprising:
obtaining a first mold including a plurality of features that correspond to a layout of a plurality of conductors for the printed circuit board;
obtaining a second mold having a plurality of features corresponding in configuration, shape, and arrangement to the features of the first mold; and
deforming a sheet comprised of an electrically-conductive material to match the features of the first mold,
wherein deforming the sheet comprised of the electrically-conductive material to match the features of the first mold comprises:
placing the sheet between the first mold and the second mold; and
pressing the second mold against the first mold so that the features of the second mold engage the features of the first mold with the sheet therebetween and the sheet is deformed by the features of the second mold into the features of the first mold.

11. The method of claim 10 further comprising:
before the first mold and the second mold are pressed together, temporarily bonding the sheet to the first mold with an adhesive agent effective to retain the sheet to the first mold when the second mold is separated from the first mold.

12. The method of claim 10 wherein the substrate includes a surface and a plurality of recesses in the surface, and the sheet occupies the recesses and covers the surface, and further comprising:
mechanically removing the electrically-conductive material of the sheet from the surface of the substrate to define the conductors in the recesses.

13. The method of claim 12 further comprising:
after the electrically-conductive material of the sheet is mechanically removed from the surface of the substrate, mechanically removing the surface of the substrate to reduce a depth of the recesses relative to the surface of the substrate.

14. The method of claim 13 wherein the depth of the recesses is greater than or equal to a thickness of the sheet.

15. The method of claim 10 further comprising:
after the sheet is deformed, applying a liquid resin material in contact with the sheet; and
curing the liquid resin material to form a substrate couple to the sheet.

Assignees

• Globalfoundries Inc

Inventors

• Devarney Craig N

Classifications

• H05K2203/025

  Abrading, e.g. grinding or sand blasting · CPC title

• H05K2201/09036

  Recesses or grooves in insulating substrate · CPC title

• H05K2201/0382

  Continuously deformed conductors · CPC title

• H05K3/045 Primary

  by making a conductive layer having a relief pattern, followed by abrading of the raised portions · CPC title