Method of manufacturing a transparent substrate

Patent metadata

Field	Value
Publication number	US-9775236-B2
Application number	US-201414371387-A
Country	US
Kind code	B2
Filing date	Mar 7, 2014
Priority date	Mar 7, 2013
Publication date	Sep 26, 2017
Grant date	Sep 26, 2017

Abstract

The present disclosure relates to a transparent substrate including: a resin pattern layer including a plurality of grooves respectively including side surfaces and a bottom surface; and, a conductive layer formed within the grooves, wherein a line width of the conductive layer is 0.1 μm to 3 μm and an average height of the conductive layer is 5% to 50% of a maximum depth of each of the grooves, and a manufacturing method thereof, such that simplicity in a manufacturing process and a consecutive process are enabled, manufacturing costs are inexpensive, and a transparent substrate having superior electrical conductivity and transparency characteristics is manufactured.

First claim

The invention claimed is:

1. A manufacturing method of a transparent substrate, comprising:
forming a resin pattern layer including a plurality of grooves respectively including a side surface and a bottom surface;
forming a conductive layer by depositing a metal on the resin pattern layer, while an average height of the conductive layer is controlled to be 5% to 50% of a maximum depth of each of the grooves and a metal deposition angle is controlled to be within a range of −15° to 15° with respect to a direction of a normal line of the resin pattern layer; and
physically removing the conductive layer from remaining regions of the resin pattern layer, other than portions of the conductive layer present in the grooves, by a method of polishing and removing the conductive layer using a melamine foam or a fabric having a rough surface.

2. The manufacturing method of claim 1 , wherein a maximum width of the groove is 0.1 μm to 3 μm, and
the maximum depth of the groove is 0.2 times to 2 times the maximum width of the groove.

3. The manufacturing method of claim 1 , wherein the side surface of the groove has an angle of inclination ranging from 0° to 15°, with respect to a vertical direction.

4. The manufacturing method of claim 1 , wherein a radius of curvature of an upper edge on the side surface of the groove is equal to or less than 0.3 times the maximum depth of the groove.

5. The manufacturing method of claim 1 , wherein a total area of bottom surfaces of the grooves is 0.1% to 5% of an overall cross-sectional area of the resin pattern layer.

6. The manufacturing method of claim 1 , wherein the forming of the resin pattern layer including the plurality of grooves is performed by an imprinting method, a photolithography method, or an electron beam lithography method.

7. The manufacturing method of claim 1 , wherein the forming of the conductive layer is performed such that a thickness of the conductive layer deposited on the side surface of the groove is 25% or less of the average height of the conductive layer.

8. The manufacturing method of claim 1 , wherein the forming of the conductive layer further includes forming an adhesion controlling layer on the resin pattern layer prior to the deposition of the metal.

9. The manufacturing method of claim 8 , wherein the forming of the adhesion controlling layer is performed by a chemical vapor deposition method or a physical vapor deposition method.

10. The manufacturing method of claim 1 , wherein the forming of the conductive layer further includes forming a blackening layer.

11. The manufacturing method of claim 10 , wherein the forming of the blackening layer is performed by a chemical vapor deposition method or a physical vapor deposition method.

12. The manufacturing method of claim 1 , further comprising:
planarizing the resin pattern layer after the physically removing the conductive layer.

13. The manufacturing method of claim 11 , wherein the forming of the blackening layer is performed such that a deposition angle is within a range of −15° to 15° with respect to the direction of the normal line of the resin pattern layer.

14. The manufacturing method of claim 1 , wherein the forming of the adhesion controlling layer is performed such that a deposition angle is within a range of −15° to 15° with respect to the direction of the normal line of the resin pattern layer.

15. A manufacturing method of a transparent substrate, comprising:
forming a resin pattern layer including a plurality of grooves respectively including a side surface and a bottom surface;
forming a conductive layer by:
forming an adhesion controlling layer on the resin pattern layer such that a deposition angle is within a range of −15° to 15° with respect to the direction of the normal line of the resin pattern layer; and
depositing a metal on the adhesion controlling layer on the resin pattern layer, while an average height of the conductive layer is controlled to be 5% to 50% of a maximum depth of each of the grooves and a metal deposition angle is controlled to be within a range of −15° to 15° with respect to a direction of a normal line of the resin pattern layer; and

physically removing the conductive layer from remaining regions of the resin pattern layer, other than portions of the conductive layer present in the grooves.

16. The manufacturing method of claim 15 , wherein a maximum width of the groove is 0.1 μm to 3 μum, and
the maximum depth of the groove is 0.2 times to 2 times the maximum width of the groove.

17. The manufacturing method of claim 15 , wherein the side surface of the groove has an angle of inclination ranging from 0° to 15°, with respect to a vertical direction.

18. The manufacturing method of claim 15 , wherein a radius of curvature of an upper edge on the side surface of the groove is equal to or less than 0.3 times the maximum depth of the groove.

19. The manufacturing method of claim 15 , wherein a total area of bottom surfaces of the grooves is 0.1% to 5% of an overall cross-sectional area of the resin pattern layer.

20. The manufacturing method of claim 15 , wherein the forming of the resin pattern layer including the plurality of grooves is performed by an imprinting method, a photolithography method, or an electron beam lithography method.

21. The manufacturing method of claim 15 , wherein the forming of the conductive layer is performed such that a thickness of the conductive layer deposited on the side surface of the groove is 25% or less of the average height of the conductive layer.

22. The manufacturing method of claim 15 , wherein the physically removing the conductive layer is performed by a scraping method, a detaching method or a combination thereof.

23. The manufacturing method of claim 15 , wherein the physically removing the conductive layer is performed by a method of polishing and removing the conductive layer, using a melamine foam or a fabric having a rough surface.

24. The manufacturing method of claim 15 , wherein the forming of the conductive layer further includes forming a blackening layer by a chemical vapor deposition method or a physical vapor deposition method.

25. The manufacturing method of claim 24 , wherein the forming of the blackening layer is performed such that a deposition angle is within a range of −15° to 15° with respect to the direction of the normal line of the resin pattern layer.

26. The manufacturing method of claim 15 , further comprising planarizing the resin pattern layer after physically removing the conductive layer.

27. A manufacturing method of a transparent substrate, comprising:
forming a resin pattern layer including a plurality of grooves respectively including a side surface and a bottom surface;
forming a conductive layer by:
depositing a metal on the resin pattern layer, while an average height of the conductive layer is controlled to be 5% to 50% of a maximum depth of each of the grooves and a metal deposition angle is controlled to be within a range of −15° to 15° with respect to a direction of a normal line of the resin pattern layer; and
forming a blackening layer by a chemical vapor deposition method or a physical vapor deposition method, wherein the forming of the blackening layer is performed such that a deposition angle is within a range of −15° to 15° with respect to the direction of the normal line of the resin pattern layer; and

physically removi

Assignees

• Lg Chemical Ltd

Inventors

• Bae Sung-Hak
• Han Sang-Choll
• Kim Byong-Mook

Classifications

• H05K3/0023

  by exposure and development of a photosensitive insulating layer · CPC title

• H05K2203/0108

  Male die used for patterning, punching or transferring · CPC title

• H05K1/0274

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• H05K3/38

  Improvement of the adhesion between the insulating substrate and the metal · CPC title

• H05K2201/0129

  Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer · CPC title