Light emitting device including a metal substrate for high heat dissipation and increased light efficiency

Patent metadata

Field	Value
Publication number	US-9728697-B2
Application number	US-201415022603-A
Country	US
Kind code	B2
Filing date	Oct 1, 2014
Priority date	Oct 3, 2013
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A light emitting device achieving a high heat dissipation effect and a high light utilization efficiency includes an aluminum substrate, a high heat dissipation ceramic layer on the aluminum substrate, an etching frame on the high heat dissipation ceramic layer, and a highly reflective ceramic layer on the high heat dissipation ceramic layer and the etching frame.

First claim

The invention claimed is:

1. A light emitting device, comprising:
a metal substrate;
a first insulating layer on the metal substrate and having light reflectivity and thermal conductivity;
a second insulating layer on the first insulating layer and having light reflectivity and thermal conductivity;
a light emitting element; and
a wiring pattern embedded inside the second insulating layer and including (i) an electrode terminal including an exposed portion that electrically connects an electrode of the light emitting element to the electrode terminal and (ii) an anode electrode and a cathode electrode that connect the wiring pattern to an external power supply that drives the light emitting element, wherein
the light emitting element is on the second insulating layer and is flip-chip bonded and electrically connected to the electrode terminal,
the thermal conductivity of the first insulating layer is higher than the thermal conductivity of the second insulating layer,
the light reflectivity of the second insulating layer is higher than the light reflectivity of the first insulating layer,
the wiring pattern includes: a first portion located immediately below the electrode terminal that has a first thickness, a second portion located immediately below the anode electrode and the cathode electrode that has a second thickness, and a third portion located immediately below the second insulating layer that has a third thickness, the first thickness and the second thickness both being thicker than the third thickness,
the anode electrode and the cathode electrode are exposed through the second insulating layer, and
in a cross section of the light emitting device, the electrode terminal includes a first electrode terminal and a second electrode terminal arranged such that a region between the first electrode terminal and the second electrode terminal includes no portion of the wiring pattern and is filled with the second insulating layer.

2. The light emitting device, according to claim 1 , wherein the first insulating layer includes a ceramic paint applied to the metal substrate.

3. The light emitting device, according to claim 1 , wherein the first insulating layer includes of an epoxy resin, a silicone resin, a fluororesin, and a polyimide resin.

4. The light emitting device, according to claim 3 , wherein the first insulating layer includes a sheet-shaped resin.

5. The light emitting device, according to claim 4 , wherein the first insulating layer includes a polytetrafluoroethylene (PTFE) sheet.

6. The light emitting device, according to claim 1 , wherein the first insulating layer includes ceramic particles.

7. The light emitting device, according to claim 1 , wherein the second insulating layer includes one of an epoxy resin, a silicone resin, a fluororesin, and a polyimide resin, each containing ceramic particles.

8. The light emitting device, according to claim 1 , wherein the second insulating layer includes a glass binder containing ceramic particles.

9. The light emitting device, according to claim 1 , wherein the metal substrate includes aluminum and is defined by covering a surface of the aluminum with an anodized aluminum protective layer by an anodization treatment.

10. The light emitting device according to claim 1 , wherein a total area of a base of the wiring pattern that supplies a current to the light emitting element is at least 5 times larger than a total area of a base of rear electrodes of the light emitting element connected to the wiring pattern.

11. A light emitting device, comprising:
a metal substrate;
an insulating layer on the metal substrate and having thermal conductivity and light reflectivity;
a light emitting element; and
a wiring pattern embedded inside the insulating layer and including (i) an electrode terminal including an exposed portion that electrically connects an electrode of the light emitting element to the electrode terminal and (ii) an anode electrode and a cathode electrode that connect the wiring pattern to an external power supply that drives the light emitting element, wherein
the light emitting element is on the insulating layer and is flip-chip bonded and electrically connected to the electrode terminal,
the wiring pattern includes a first portion located immediately below the electrode terminal and has a first thickness, a second portion located immediately below the anode and the cathode and has a second thickness, and a third portion located immediately below the insulating layer and has a third thickness, the first thickness and the second thickness being thicker than the third thickness,
the anode electrode and the cathode electrode are exposed through the insulating layer, and
in a cross section of the light emitting device, the electrode terminal includes a first electrode terminal and a second electrode terminal arranged such that a region between the first electrode terminal and the second electrode terminal includes no portion of the wiring pattern and is filled with the insulating layer.

12. The light emitting device, according to claim 11 , wherein the insulating layer includes one of an epoxy resin, a silicone resin, a fluororesin, and a polyimide resin.

13. The light emitting device, according to claim 12 , wherein the insulating layer includes a sheet-shaped resin.

14. The light emitting device, according to claim 13 , wherein the insulating layer includes a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) sheet.

15. The light emitting device, according to claim 11 , wherein the insulating layer includes ceramic particles.

16. The light emitting device according to claim 11 , wherein the metal substrate includes aluminum and is defined by covering a surface of the aluminum with an anodized aluminum protective layer by an anodization treatment.

17. The light emitting device according to claim 11 , wherein a total area of a base of the wiring pattern that supplies a current to the light emitting element is at least 5 times larger than a total area of a base of rear electrodes of the light emitting element connected to the wiring pattern.

18. A method for manufacturing a light emitting device, comprising:
producing a metal substrate by forming an anodized aluminum protective layer on a surface of a substrate including aluminum by performing an anodization treatment;
forming a conductive layer and a first insulating layer that has thermal conductivity and light reflectivity by attaching a composite sheet to the metal substrate, where the composite sheet is obtained by attaching a sheet-shaped epoxy resin that includes ceramic particles so as to have enhanced thermal conductivity to a metal sheet including copper;
forming a wiring pattern from the conductive layer by etching;
forming a second insulating layer, which has thermal conductivity lower than the thermal conductivity of the first insulating layer and which has light reflectivity higher than the light reflectivity of the first insulating layer, on the first insulating layer and the wiring pattern by coating and, exposing (i) an electrode terminal of the wiring pattern that is electrically connected to an electrode of the light emitting element and (ii) an anode electrode and a cathode electrode that connect the wiring pattern to an external power supply that drives the light emitting element;
coating the electrode terminal by metal plating; and
electrically connecting, by flip chip bonding, the light emitting element and the electrode terminal portion on the second insulating layer, wherein
the wiring pat

Assignees

• Sharp Kk

Inventors

• Konishi Masahiro
• Nokubo Hiroyuki
• Itoh Shin
• Nakanishi Takashi
• Yamaguchi Ippei
• Fujita Yuhsuke

Classifications

• H10W90/00

  Package configurations · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K3/202

  using self-supporting metal foil pattern · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K2201/2054

  Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics · CPC title