Wafer-level chip scale package with re-workable underfill

Patent metadata

Field	Value
Publication number	US-9240387-B2
Application number	US-201113272009-A
Country	US
Kind code	B2
Filing date	Oct 12, 2011
Priority date	Oct 12, 2011
Publication date	Jan 19, 2016
Grant date	Jan 19, 2016

Abstract

A package includes a printed circuit board (PCB), and a die bonded to the PCB through solder balls. A re-workable underfill is dispensed in a region between the PCB and the die.

First claim

What is claimed is:

1. A package comprising:
a printed circuit board (PCB);
a die bonded to the PCB through solder balls; and
a re-workable underfill dispensed in a region between the PCB and the die, wherein there is a gap between the underfill and at least one of the PCB and the die, wherein the gap has a height from about 75 percent to about 25 percent of a standoff distance between the PCB and the die, and wherein the height is measured in a direction perpendicular to a major surface of the PCB.

2. The package of claim 1 , wherein the re-workable underfill has a molecular weight ranging between 30,000 and about 300,000.

3. The package of claim 1 , wherein the underfill is in physical contact with the PCB, and is not in physical contact with the die.

4. The package of claim 1 , wherein the underfill is in physical contact with the die, and is not in physical contact with the PCB.

5. The package of claim 1 , wherein the region between the PCB and the die comprises a center region, corner regions, and edge regions, with the corner regions and the edge regions surrounding the center region, and wherein the underfill is in one of the corner regions, and is not in the center region.

6. The package of claim 5 , wherein the underfill filled into two neighboring corner regions form two underfill regions separated from each other, with no underfill interconnecting the two underfill regions.

7. The package of claim 6 , wherein the underfill is further in one of the edge regions connecting the two underfill regions.

8. A package comprising:
a printed circuit board (PCB);
a die, wherein the region between the PCB and the die comprises:
a center region adjacent to a center of the die;
corner regions adjacent to corners of the die; and
edge regions adjacent to edges of the die, wherein the corner regions and the edge regions surround the center region, and wherein each of the edge regions interconnects two of the corner regions;

solder balls bonding the PCB to the die, wherein each of the center region, the edge regions, and the corner regions comprises at least one of the solder balls therein; and
an underfill dispensed into one of the corner regions, wherein the underfill is not dispensed into the center region, wherein a height of the underfill is between about 25 percent and about 75 percent a standoff distance between the PCB and the die, and wherein the height is measured in a direction perpendicular to a major surface of the PCB.

9. The package of claim 8 , wherein the one of the corner regions comprises at least 3×3 solder balls therein, with the at least 3×3 solder balls being in contact with the underfill.

10. The package of claim 8 , wherein the region between the PCB and the die comprises four corner regions, wherein the underfill is dispensed into the four corner regions, and wherein at least one of the edge regions is free from the underfill.

11. The package of claim 8 , wherein the underfill is dispensed into four corner regions and four edge regions.

12. The package of claim 11 , wherein the underfill dispensed into the four corner regions and the four edge regions forms a full loop encircling the center region in a top view of the package.

13. A package comprising:
a printed circuit board (PCB);
a die, wherein the region between the PCB and the die comprises:
a center region;
corner regions; and
edge regions, with the corner regions and the edge regions surrounding the center region, wherein each of the edge regions interconnects two of the corner regions;

solder balls bonding the PCB to the die, wherein each of the center region, the edge regions, and the corner regions comprises at least one of the solder balls therein; and
an underfill dispensed into the corner regions to form discrete underfill regions separated from each other, wherein the underfill contacts the solder balls that are in the corner regions, wherein no underfill is filled into the center region, and wherein the underfill is in contact with the PCB, and is not in physical contact with the die, wherein a height of the underfill is between about 25 percent and about 75 percent a standoff distance between the PCB and the die, and wherein the height is measured in a direction perpendicular to a major surface of the PCB.

14. The package of claim 13 , wherein portions of the solder balls in the center region are surrounded by air-gaps in a top view of the package.

15. The package of claim 13 , wherein the solder balls in at least one of the edge regions is not in physical contact with the underfill.

16. The package of claim 13 , wherein portions of the solder balls in the edge regions are surrounded by air-gaps in a top view of the package.

17. The package of claim 13 , wherein in one of the corner regions, the underfill surrounds, and is in contact with, at least three rows by three columns of the solder balls.

Assignees

• Chen Hsien-Wei
• Wang Tsung-Ding
• Lee Chien-Hsiun
• Tsai Hao-Yi
• Lii Mirng-Ji
• Yu Chen-Hua
• Taiwan Semiconductor Mfg

Inventors

• Chen Hsien-Wei
• Wang Tsung-Ding
• Lee Chien-Hsiun
• Tsai Hao-Yi
• Lii Mirng-Ji
• Yu Chen-Hua

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title

• H10W72/9223

  with redistribution layers [RDL] · CPC title

• H10W72/07353

  changes in shapes · CPC title