Rigid interconnect structures in package-on-package assemblies
US-9768105-B2 · Sep 19, 2017 · US
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Lii Mirng-Ji patents
Lii Mirng-Ji holds 13 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 13 |
| Recent patents | 0 |
| First publication | May 5, 2015 |
| Latest publication | Sep 19, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Post-passivation interconnect structure
US-9613914-B2 · Apr 4, 2017 · US
Semiconductor package and method of forming the same
US-9536818-B2 · Jan 3, 2017 · US
Connecting function chips to a package to form package-on-package
US-9449941-B2 · Sep 20, 2016 · US
Conical-shaped or tier-shaped pillar connections
US-9425136-B2 · Aug 23, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Rigid interconnect structures in package-on-package assemblies
US-9768105-B2 · Sep 19, 2017 · US
Post-passivation interconnect structure
US-9613914-B2 · Apr 4, 2017 · US
Semiconductor package and method of forming the same
US-9536818-B2 · Jan 3, 2017 · US
Connecting function chips to a package to form package-on-package
US-9449941-B2 · Sep 20, 2016 · US
Conical-shaped or tier-shaped pillar connections
US-9425136-B2 · Aug 23, 2016 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H01L2924/00014 | 11 |
| H10W72/252 | 10 |
| H10W90/724 | 9 |
| H01L2924/00 | 9 |
| H01L24/13 | 8 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 13 |
| Operations & Transport | 1 |
| Cross-Sectional Technologies | 1 |