System in package process flow
US-9881898-B2 · Jan 30, 2018 · US
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Wang Tsung-Ding patents
Wang Tsung-Ding holds 7 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 7 |
| Recent patents | 0 |
| First publication | Mar 24, 2015 |
| Latest publication | Jan 30, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Strain reduced structure for IC packaging
US-9806042-B2 · Oct 31, 2017 · US
Semiconductor package having a recess filled with a molding compound
US-9275924-B2 · Mar 1, 2016 · US
Wafer-level chip scale package with re-workable underfill
US-9240387-B2 · Jan 19, 2016 · US
Integrated inductor
US-9219106-B2 · Dec 22, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
System in package process flow
US-9881898-B2 · Jan 30, 2018 · US
Strain reduced structure for IC packaging
US-9806042-B2 · Oct 31, 2017 · US
Semiconductor package having a recess filled with a molding compound
US-9275924-B2 · Mar 1, 2016 · US
Wafer-level chip scale package with re-workable underfill
US-9240387-B2 · Jan 19, 2016 · US
Integrated inductor
US-9219106-B2 · Dec 22, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H01L24/13 | 7 |
| H10W72/29 | 6 |
| H10W72/252 | 6 |
| H10W90/724 | 5 |
| H10W72/9415 | 5 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 7 |