Substrate processing apparatus, substrate processing method, and storage medium

Patent metadata

Field	Value
Publication number	US-9236280-B2
Application number	US-201113301936-A
Country	US
Kind code	B2
Filing date	Nov 22, 2011
Priority date	Nov 26, 2010
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

Disclosed is a substrate processing apparatus including a processing vessel in which a target substrate W is processed by using a high-pressure fluid in a supercritical state or a subcritical state, and pipes that are divided into a first pipe member and a second pipe member in a flowing direction of the fluid and circulate the fluid are connected to processing vessel. A connecting/disconnecting mechanism moves at least one of first and second pipe members between a connection position and a separation position of first pipe member and the second pipe member, and opening/closing valves are installed in each of first and second pipe members and are closed at the time of separating pipe members.

First claim

What is claimed is:

1. A substrate processing apparatus, comprising:
a processing vessel configured to perform a processing for a target substrate by using pressurized fluid that is in a supercritical state or subcritical state;
a preparation vessel configured to convert received liquid into the pressurized fluid;
a heating mechanism configured to heat the preparation vessel in order to convert the received liquid into the pressurized fluid;
a pipe supplying a raw material in a liquid state, wherein the pipe is in fluid communication with the processing vessel and the preparation vessel, and wherein the pipe is divided into a first pipe member and a second pipe member;
a connecting/disconnecting mechanism configured to move at least one of the first pipe member and the second pipe member between a connection position at which the first pipe member and the second pipe member are connected and a separation position at which the first pipe member and the second pipe member are separated; and
an opening/closing valve in each of the first pipe member and the second pipe member.

2. The substrate processing apparatus of claim 1 , comprising:
a cooling mechanism configured to cool the preparation vessel.

3. The substrate processing apparatus of claim 2 , wherein the preparation vessel also serves as a recovery vessel that recovers the fluid after completing the processing of the target substrate and receives recovered fluid through the pipe.

4. The substrate processing apparatus of claim 1 , wherein the apparatus comprises a fluid receiving unit with a discharge path to collect and discharge fluid that flows out of the pipe when the first pipe member and the second pipe member are seperated.

5. The substrate processing apparatus of claim 4 , wherein the fluid receiving unit is configured as a case that partitions the connecting/disconnecting mechanism from a surrounding atmosphere.

6. The substrate processing apparatus of claim 1 , further comprising a control unit that outputs a control signal to execute a separating operation of separating the pipe members after closing both the opening/closing valves of the first pipe member and the second pipe member and a connecting operation of opening both the opening/closing valves after connecting the pipe members.

7. The substrate processing apparatus of claim 1 , wherein the processing performed with respect to the substrate by using the pressurized fluid is a dry processing of the target substrate.

8. A substrate processing method, comprising:
placing a substrate in a processing vessel;
heating a fluid in a preparation vessel that is connected to the processing vessel by way of a pipe supplying a raw material in a liquid state, wherein the pipe comprises a first pipe member and a second pipe member, and wherein a connecting/disconnecting mechanism is configured to move at least one of the first pipe member and the second pipe member between a connection position at which the first pipe member and the second pipe member are connected and a separation position at which the first pipe member and the second pipe member are separated;
supplying the fluid to the processing vessel, wherein the fluid is supplied to the processing vessel through the pipe;
dividing and separating the pipe connected to the processing vessel by having the connecting/disconnecting mechanism move at least one of the first pipe member and the second pipe member such that the pipe members are in the separation position;
processing the target substrate in the processing vessel, wherein the target substrate is processed with the fluid when the fluid is in a supercritical or subcritical state; and
discharging the fluid through the pipe after completing the processing of the target substrate by having the connecting/disconnecting mechanism move at least one of the first pipe member and the second pipe member such that the pipe member are in the connection position.

9. The substrate processing method of claim 8 , further comprising:
supplying liquid to the preparation vessel;
sealing the preparation vessel;
dividing and separating the pipe that connects the preparation vessel to the processing vessel;
supplying the fluid to the processing vessel form the preparation vessel by connecting the separated pipes; and
cooling the preparation vessel.

10. The substrate processing method of claim 9 , further comprising:
cooling fluid discharged from the processing vessel and recovering the cooled fluid in a liquid state.

11. The substrate processing method of claim 8 , wherein the processing performed with respect to the target substrate with the fluid is a dry processing of the target substrate.

12. A non-transitory computer-readable recording medium storing an executable program that, when executed, causes a computer to execute a substrate processing method used in a substrate processing apparatus processing a target substrate by using pressurized fluid, the method comprising:
heating a fluid in a preparation vessel that is connected to a processing vessel by way of a pipe, wherein the pipe comprises a first pipe member and a second pipe member, and wherein a connecting/disconnecting mechanism is configured to move at least one of the first pipe member and the second pipe member between a connection position at which the first pipe member and the second pipe member are connected and a separation position at which the first pipe member and the second pipe member are separated;
supplying the fluid to the processing vessel where a target substrate is located, wherein the fluid is supplied to the processing vessel through the pipe;
dividing and separating the pipe connected to the processing vessel by having the connecting/disconnecting mechanism move at least one of the first pipe member and the second pipe member such that the pipe members are in the separation position;
processing the target substrate in the processing vessel, wherein the target substrate is processed with the fluid when the fluid is in a supercritical or subcritical state; and
discharging the fluid through the pipe after completing the processing of the target by having the connecting/disconnecting mechanism move at least one of the first pipe member and the second pipe member such that the pipe member are in the connection position.

13. The non-transitory computer-readable recording medium of claim 12 , the method further comprising:
supplying liquid to the preparation vessel;
sealing the preparation vessel;
dividing and separating the pipe that connects the preparation vessel to the processing vessel;
supplying the fluid to the processing vessel form the preparation vessel by connecting the separated pipes; and
cooling the preparation vessel.

14. The non-transitory computer-readable recording medium of claim 13 , the method further comprising:
cooling fluid discharged from the processing vessel and recovering the cooled fluid in a liquid state.

15. The non-transitory computer-readable recording medium of claim 12 , wherein the processing performed with respect to the target substrate with the fluid is a dry processing of the target substrate.

Assignees

• Toshima Takayuki
• Iwashita Mitsuaki
• Kamikawa Yuji
• Nakashima Mikio
• Tokyo Electron Ltd

Inventors

• Toshima Takayuki
• Iwashita Mitsuaki
• Kamikawa Yuji
• Nakashima Mikio

Classifications

• H10P70/80

  Cleaning only by supercritical fluids · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• B08B3/04

  Cleaning involving contact with liquid · CPC title