Sputtering target assembly

Patent metadata

Field	Value
Publication number	US-9224584-B2
Application number	US-201214375239-A
Country	US
Kind code	B2
Filing date	Sep 25, 2012
Priority date	Jan 31, 2012
Publication date	Dec 29, 2015
Grant date	Dec 29, 2015

Abstract

Provided is a sputtering target assembly comprising two or more sputtering target-backing plate bonded bodies B aligned in the width direction, wherein the sputtering target-backing plate bonded bodies B each include a cylindrical target having a diameter of 100 mm or more and a length of 1000 mm or more and composed of three or more target pieces A being divided such that the dividing lines lie in the circumferential direction and being bonded or placed onto a cylindrical or columnar backing plate, wherein the bonded bodies B are arranged to form the sputtering target assembly in such a manner that the dividing lines between the three target pieces of one bonded body B are not present at the same positions of the dividing lines between fractional target pieces of adjacent another bonded body B. It is an object of the present invention to provide a sputtering target assembly that can reduce defects due to occurrence of particles originated from the piece-bonding area.

First claim

The invention claimed is:

1. A sputtering target assembly comprising two or more bonded bodies, each of the bonded bodies comprising a hollow cylindrical sputtering target surrounding and being bonded or placed onto an outer surface of a backing tube, and the bonded bodies being aligned parallel to each other with a space therebetween, wherein each of the cylindrical sputtering targets has an outer diameter of 100 mm or more and a length of 1000 mm or more and is composed of three or more separate target pieces stacked together without a gap therebetween and with only dividing lines appearing therebetween in a circumferential direction about the cylindrical sputtering target, and wherein the bonded bodies and the target pieces are made or arranged to form the sputtering target assembly in such a manner that any two of the dividing lines of adjacent bonded bodies are not aligned together to form a straight line.

2. The sputtering target assembly according to claim 1 , wherein at least one of the bonded bodies includes one or more target pieces having a difference in length relative to the other target pieces of the same bonded body, the difference in length being 20 mm or more.

3. The sputtering target assembly according to claim 1 , wherein at least one of the bonded bodies includes one or more target pieces having a difference in length relative to the other target pieces of the same bonded body, the difference in length being 50 mm or more.

4. The sputtering target assembly according to claim 1 , wherein at least one of the bonded bodies includes one or more target pieces having a difference in length relative to the other target pieces of the same bonded body, the difference in length being 100 mm or more.

5. The sputtering target assembly according to claim 4 , wherein the dividing lines of one of the bonded bodies are parallel to the dividing lines of an adjacent one of the bonded bodies, and wherein the dividing lines of said one of the bonded bodies and the dividing lines of said adjacent one of the bonded bodies are spaced apart in a direction perpendicular to the parallel dividing lines by a distance of 20 mm or more.

6. The sputtering target assembly according to claim 4 , wherein the dividing lines of one of the bonded bodies are parallel to the dividing lines of an adjacent one of the bonded bodies, and wherein the dividing lines of said one of the bonded bodies and the dividing lines of said adjacent one of the bonded bodies are spaced apart in a direction perpendicular to the parallel dividing lines by a distance of 50 mm or more.

7. The sputtering target assembly according to claim 4 , wherein the dividing lines of one of the bonded bodies are parallel to the dividing lines of an adjacent one of the bonded bodies, and wherein the dividing lines of said one of the bonded bodies and the dividing lines of said adjacent one of the bonded bodies are spaced apart in a direction perpendicular to the parallel dividing lines by a distance of 100 mm or more.

8. The sputtering target assembly according to claim 7 , wherein all of the target pieces of one of the bonded bodies are of the same length.

9. The sputtering target assembly according to claim 1 , wherein the dividing lines of one of the bonded bodies are parallel to the dividing lines of an adjacent one of the bonded bodies, and wherein the dividing lines of said one of the bonded bodies and the dividing lines of said adjacent one of the bonded bodies are spaced apart in a direction perpendicular to the parallel dividing lines by a distance of 20 mm or more in each dividing line.

10. The sputtering target assembly according to claim 1 , wherein the dividing lines of one of the bonded bodies are parallel to the dividing lines of an adjacent one of the bonded bodies, and wherein the dividing lines of said one of the bonded bodies and the dividing lines of said adjacent one of the bonded bodies are spaced apart in a direction perpendicular to the parallel dividing lines by a distance of 50 mm or more.

11. The sputtering target assembly according to claim 1 , wherein the dividing lines of one of the bonded bodies are parallel to the dividing lines of an adjacent one of the bonded bodies, and wherein the dividing lines of said one of the bonded bodies and the dividing lines of said adjacent one of the bonded bodies are spaced apart in a direction perpendicular to the parallel dividing lines by a distance of 100 mm or more.

12. The sputtering target assembly according to claim 1 , wherein all of the target pieces of one of the bonded bodies are of the same length.

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Osada Kozo
• Kurihara Toshiya

Classifications

• H01J37/3435

  Target holders (includes backing plates and endblocks) · CPC title

• H01J37/3423 Primary

  Shape · CPC title

• H01J37/342

  Hollow targets · CPC title

• H01J37/3417

  Arrangements · CPC title

• C23C14/3407 Primary

  Cathode assembly for sputtering apparatus, e.g. Target · CPC title