Chuck and semiconductor process using the same

Patent metadata

Field	Value
Publication number	US-9111850-B2
Application number	US-201514670440-A
Country	US
Kind code	B2
Filing date	Mar 27, 2015
Priority date	Aug 31, 2012
Publication date	Aug 18, 2015
Grant date	Aug 18, 2015

Abstract

A semiconductor process is described in this application. The process includes the following steps: providing a semiconductor substrate; measuring a warpage level of the semiconductor substrate; and holding the semiconductor substrate by providing at least one vacuum suction according to the warpage level, so that the semiconductor substrate is subjected to a plurality of varied suction intensities. The semiconductor substrate is held on a chuck having a plurality of holes grouped into a plurality of groups, and the sizes of the holes within different groups are different, wherein the sizes of the holes increase from a center toward an edge of the chuck, and the holes are arranged in a spiral.

First claim

What is claimed is:

1. A semiconductor process, comprising:
providing a semiconductor substrate;
measuring a warpage level of the semiconductor substrate; and
holding the semiconductor substrate by providing at least one vacuum suction according to the warpage level, so that the semiconductor substrate is subjected to a plurality of varied suction intensities, wherein the semiconductor substrate is held on a chuck having a plurality of holes grouped into a plurality of groups,…

Assignees

• United Microelectronics Corp

Inventors

• Jang Chung-Sung
• Lin Ming-Tse
• Lin Yung-Chang

Classifications

• H10P74/203

  Electricity · mapped topic

• H10P72/7402

  Electricity · mapped topic

• H10P72/78 Primary

  Electricity · mapped topic

• H10P74/23 Primary

  Electricity · mapped topic

• G03F7/20

  Physics · mapped topic