Wafer processing method

Patent metadata

Field	Value
Publication number	US-9105708-B2
Application number	US-201314013965-A
Country	US
Kind code	B2
Filing date	Aug 29, 2013
Priority date	Sep 10, 2012
Publication date	Aug 11, 2015
Grant date	Aug 11, 2015

Abstract

A wafer processing method divides a wafer along a plurality of crossing streets formed on the front side of the wafer to thereby partition a plurality of regions where a plurality of devices are respectively formed. The method includes a division groove forming step of cutting the back side of the wafer along each street by using a cutting blade to thereby form a division groove along each street with a predetermined thickness left between the bottom of the division groove and the front side of the wafer, a wafer supporting step of attaching the back side of the wafer to a dicing tape supported by an annular frame, and a wafer dividing step of applying an external force to the wafer attached to the dicing tape to thereby divide the wafer into the individual devices along the streets where the division grooves are respectively formed.

First claim

What is claimed is:

1. A wafer processing method of dividing a wafer formed of a wafer material along a plurality of crossing streets formed on the front side of said wafer to thereby partition a plurality of regions where a plurality of devices are respectively formed, said wafer processing method comprising:
a protective member attaching step of attaching a protective member to the front side of said wafer;
a division groove forming step of cutting the back side of said wafer…

Assignees

• Disco Corp

Inventors

• Uchida Fumio

Classifications

• H10P74/203

  Electricity · mapped topic

• H10P74/23

  Electricity · mapped topic

• H10P72/7402

  Electricity · mapped topic

• H10P72/0442

  Electricity · mapped topic

• H10P72/74

  Electricity · mapped topic