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Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process
US9102033B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9102033-B2 |
| Application number | US-95358410-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 24, 2010 |
| Priority date | Nov 24, 2010 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
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An apparatus and method for providing target thickness and surface profile uniformity control of a multi-head chemical mechanical polishing (CMP) process is disclosed. An exemplary method includes providing at least two wafers; determining a surface profile of each of the at least two wafers; determining an operation mode for a chemical mechanical polishing (CMP) process based on the surface profiles of the at least two wafers; determining a CMP polishing recipe for each of the at least two wafers based on the operation mode; and performing the CMP process on the at least two wafers based on the determined CMP polishing recipes.
First claim
Opening claim text (preview).
What is claimed is: 1. A method comprising: providing at least two wafers; determining a surface profile of each of the at least two wafers; determining an operation mode for a chemical mechanical polishing (CMP) process based on the surface profiles of the at least two wafers; determining a CMP polishing recipe for each of the at least two wafers based on the operation mode; and performing the CMP process on the at least two wafers based on the determined CMP polishing re…
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Electricity · mapped topic
Electricity · mapped topic
- H10P52/402Primary
Electricity · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US9102033B2 cover?
- An apparatus and method for providing target thickness and surface profile uniformity control of a multi-head chemical mechanical polishing (CMP) process is disclosed. An exemplary method includes providing at least two wafers; determining a surface profile of each of the at least two wafers; determining an operation mode for a chemical mechanical polishing (CMP) process based on the surface pr…
- Who is the assignee on this patent?
- Hui Keung, Sung Jin-Ning, Kang Huang Soon, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H10P52/402. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).