Method and apparatus for performing a polishing process in semiconductor fabrication
US-10857649-B2 · Dec 8, 2020 · US
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Kang Huang Soon patents
Kang Huang Soon holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Aug 11, 2015 |
| Latest publication | Dec 8, 2020 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method and apparatus for performing a polishing process in semiconductor fabrication
US-10857649-B2 · Dec 8, 2020 · US
Manufacture and method of making the same
US-9242342-B2 · Jan 26, 2016 · US
Apparatus and method for target thickness and surface profile uniformity control of multi-head chemical mechanical polishing process
US-9102033-B2 · Aug 11, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 3 |
| Electricity | 3 |