Thermal processing apparatus and cooling method

Patent metadata

Field	Value
Publication number	US-9099505-B2
Application number	US-88155610-A
Country	US
Kind code	B2
Filing date	Sep 14, 2010
Priority date	Sep 26, 2009
Publication date	Aug 4, 2015
Grant date	Aug 4, 2015

Abstract

A thermal processing apparatus including: a cylindrical processing vessel; a support unit to be loaded into and unloaded from the vessel; and a heating furnace surrounding an outer periphery of the vessel, with a cooling space therebetween. The furnace is connected to a cooling-gas introduction unit, including a gas introduction passage to which a blowing fan is connected, for introducing a cooling gas into the cooling space during a temperature lowering operation after a thermal process. The furnace is connected to a cooling-gas discharge unit, including a heat exchanger, a suction fan, and a gas discharge passage, for discharging the cooling gas of a raised temperature from the cooling space. Connected to the gas discharge passage at a position upstream of the heat exchanger is a temperature-lowering gas introduction unit for introducing a temperature-lowering gas to the cooling gas of a raised temperature so as to lower its temperature.

First claim

The invention claimed is:

1. A thermal processing apparatus configured to thermally process a plurality of objects to be processed, the thermal processing apparatus comprising:
a processing vessel;
a support unit capable of being moved to be loaded into and unloaded from the processing vessel, while supporting the plurality of objects to be processed;
a heating furnace disposed outside the processing vessel to surround the processing vessel, with a cooling space through which a gas can pass, being defined between the heating furnace and the processing vessel;
a cooling-gas introduction unit disposed on the heating furnace, the cooling-gas introduction unit including a blowing fan and a gas introduction passage, for introducing a cooling gas for cooling the processing vessel into the cooling space;
a cooling-gas discharge unit disposed on the heating furnace, the cooling-gas discharge unit including a gas discharge passage, a heat exchanger, and a suction fan, for discharging the cooling gas of a raised temperature from the cooling space; and
a temperature-lowering gas introduction unit disposed between the cooling space and the heat exchanger,
wherein the gas discharge passage extends outside from the heating furnace to the heat exchanger, and
a mixer is disposed on a connection position of the gas discharge passage between the heating furnace and the heat exchanger, at which the gas discharge passage and the temperature-lowering-gas introduction passage are connected to each other, and the temperature-lowering gas and the cooling gas are mixed with each other.

2. The thermal processing apparatus according to claim 1 , wherein:
the heating furnace is disposed on an outer peripheral side of the processing vessel to surround the processing vessel, with the cooling space of a predetermined width being defined between the heating furnace and the processing vessel;
the heat exchanger and the suction fan of the gas discharge passage are arranged in this order from an upstream side to a downstream side; and
the temperature-lowering-gas introduction unit is disposed on the gas discharge passage at a position on an upstream side of the heat exchanger, and is configured to introduce a temperature-lowering gas to be mixed with the cooling gas of a raised temperature so as to lower a temperature thereof.

3. The thermal processing apparatus according to claim 1 , wherein
the temperature-lowering-gas introduction unit includes:
a temperature-lowering-gas introduction passage connected to the gas discharge passage;
a valve disposed on the temperature-lowering-gas introduction passage, the valve being configured to control a flow of the temperature-lowering gas;
a gas-temperature measuring unit disposed on the gas discharge passage at a position on an upstream side of the heat exchanger, the gas-temperature measuring unit being configured to measure a temperature of a gas flowing into the heat exchanger; and
a valve controller configured to control the valve such that a temperature of the gas flowing into the heat exchanger becomes a predetermined temperature or less, based on a measured temperature value of the gas-temperature measuring unit.

4. The thermal processing apparatus according to claim 3 , wherein
the valve is an opening and closing valve whose valve opening degree can be adjusted.

5. The thermal processing apparatus according to claim 1 , wherein
the temperature-lowering-gas introduction unit includes:
a temperature-lowering-gas introduction passage connected to the gas discharge passage;
a fan for lowering temperature connected to the temperature-lowering-gas introduction passage;
a valve disposed on the temperature-lowering-gas introduction passage, the valve being configured to control a flow of the temperature-lowering gas; and
a valve controller configured to control the valve such that a temperature of the gas flowing into the heat exchanger becomes a predetermined temperature or less, based on a preset time period in which a start of a cooling operation is determined as a starting point.

6. The thermal processing apparatus according to claim 5 , wherein
the valve is an opening and closing valve whose valve opening degree can be adjusted.

7. The thermal processing apparatus according to claim 5 , wherein
a mixer is disposed on a connection position at which the gas discharge passage and the temperature-lowering-gas introduction passage are connected to each other.

8. A thermal processing apparatus configured to thermally process a plurality of objects to be processed, the thermal processing apparatus comprising:
a processing vessel;
a support unit capable of being moved to be loaded into and unloaded from the processing vessel, while supporting the plurality of objects to be processed;
a heating furnace disposed outside the processing vessel to surround the processing vessel, with a cooling space through which a gas can pass being defined between the heating furnace and the processing vessel;
a cooling-gas introduction unit disposed on the heating furnace, the cooling-gas introduction unit including a blowing fan and a gas introduction passage, for introducing a cooling gas for cooling the processing vessel into the cooling space;
a cooling-gas discharge unit disposed on the heating furnace, the cooling-gas discharge unit including a gas discharge passage, a heat exchanger, and a suction fan, for discharging the cooling gas of a raised temperature from the cooling space; and
a bypass unit, including a bypass passage, configured to communicate the gas introduction passage and the gas discharge passage so as to bypass a part of the cooling gas,
wherein the gas discharge passage extends outside from the heating furnace to the heat exchanger, and
a mixer is disposed on a connection position of the gas discharge passage between the heating furnace and the heat exchanger, at which gases in the gas discharge passage and the bypass passage are mixed with each other.

9. The thermal processing apparatus according to claim 8 , wherein:
the heating furnace is disposed on an outer peripheral side of the processing vessel to surround the processing vessel, with the cooling space of a predetermined width being defined between the heating furnace and the processing vessel; and
the heat exchanger and the suction fan of the gas discharge passage are arranged in this order from an upstream side to a downstream side.

10. The thermal processing apparatus according to claim 8 , wherein:
the bypass unit includes:
a bypass passage that communicates a downstream side of the blowing fan of the gas introduction passage and an upstream side of the heat exchanger disposed on the gas discharge passage with each other;
a valve disposed on the bypass passage; the valve being configured to control a flow of a bypassed gas;
a gas-temperature measuring unit configured to measure a temperature of a gas flowing into the heat exchanger; and
a valve controller configured to control the valve such that a temperature of the gas becomes a predetermined temperature or less, based on a measured temperature value of the gas-temperature measuring unit.

11. The thermal processing apparatus according to claim 10 , wherein
the valve is an opening and closing valve whose valve opening degree can be adjusted.

12. The thermal processing apparatus according to claim 8 , wherein
the bypass unit includes:
a bypass passage that communicates a downstream side of the blowing fan of the gas introduction passage and an upstream side of the heat exchanger disposed on the gas discharge passage with each other;
a valve disposed on the bypass passage; the valve being configu

Assignees

• Kusakabe Yoshinori
• Yamaga Kenichi
• Tokyo Electron Ltd

Inventors

• Kusakabe Yoshinori
• Yamaga Kenichi

Classifications

• H10P72/0434 Primary

  mainly by convection · CPC title

• C30B35/00

  Apparatus not otherwise provided for, specially adapted for the growth, production or after-treatment of single crystals or of a homogeneous polycrystalline material with defined structure · CPC title

• C30B25/10

  Heating of the reaction chamber or the substrate · CPC title

• H01L21/67109 Primary

  Electricity · mapped topic