Back grinding apparatus and wear amount measuring method using the same
US-2024424637-A1 · Dec 26, 2024 · US
Method and apparatus for temporary bonding of ultra thin wafers
US9064686B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9064686-B2 |
| Application number | US-201313790684-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 8, 2013 |
| Priority date | Apr 15, 2010 |
| Publication date | Jun 23, 2015 |
| Grant date | Jun 23, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for temporary bonding two wafer surfaces comprising: providing a first wafer comprising first and second wafer surfaces opposite to each other; providing a second wafer comprising first and second wafer surfaces opposite to each other; applying a first adhesive layer upon said first surface of said first wafer; curing the first adhesive layer, thereby producing a cured first adhesive layer; applying a second adhesive layer upon said fi…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9064686B2 cover?
- A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with th…
- Who is the assignee on this patent?
- George Gregory, Lutter Stefan, Suss Microtec Lithography Gmbh
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 23 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).