Method and apparatus for temporary bonding of ultra thin wafers
US-2015251396-A1 · Sep 10, 2015 · US
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Lutter Stefan patents
Lutter Stefan holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Jun 23, 2015 |
| Latest publication | Sep 10, 2015 |
Filing trend
Year-over-year patent counts for this assignee.
Not enough yearly data to assess filing trend yet.
| Year | Patents |
|---|---|
| 2015 | 2 |
| Year | Patents |
|---|---|
| 2015 | 2 |
Recent patents
Latest publications where this party is an assignee.
Method and apparatus for temporary bonding of ultra thin wafers
US-9064686-B2 · Jun 23, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method and apparatus for temporary bonding of ultra thin wafers
US-2015251396-A1 · Sep 10, 2015 · US
Method and apparatus for temporary bonding of ultra thin wafers
US-9064686-B2 · Jun 23, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10P72/7422 | 2 |
| H10P72/7416 | 2 |
| H10P72/7412 | 2 |
| H10P72/7402 | 2 |
| H10P72/744 | 2 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 2 |
| Electricity | 2 |
| Cross-Sectional Technologies | 2 |