Circuit board testing apparatus and circuit board testing method

Patent metadata

Field	Value
Publication number	US-2016103172-A1
Application number	US-201514876846-A
Country	US
Kind code	A1
Filing date	Oct 7, 2015
Priority date	Oct 8, 2014
Publication date	Apr 14, 2016
Grant date	—

Abstract

In a circuit board testing apparatus for performing a four-terminal measurement method on a wiring pattern formed of a plurality of wires on a circuit board, a control part connects in series contact probes to be connected to upstream-side voltage detection terminals or downstream-side voltage detection terminals, via connection terminals, allows a power supply part to apply power between the test points with which the contact probes connected in series are in contact, allows a voltage detection part to detect a voltage between the test points, and makes a determination as to conductive contact states of the contact probes with the test points, based on the detected voltage.

First claim

What is claimed is:

1 . A circuit board testing apparatus for measuring at least one electrical characteristic of a wiring pattern formed of a plurality of wires on a circuit board, the wiring pattern having at least two test points defined thereon, the apparatus comprising:
at least two pairs of contact probes each of the pairs of contact probes configured to establish electrical contact with one of said test points, each contact probe comprising, respectively:
an upstream power terminal having a switchable connection to an upstream side of a power supply part,
a downstream power terminal having a switchable connection to a downstream side of the power supply part,
an upstream voltage detection terminal having a switchable connection to an upstream side of a voltage detection part,
a downstream voltage detection terminal having a switchable connection to a downstream side of the voltage detection part, and
a switchable connection terminal; and
a control part configured to perform a measurement of a first value related to the at least one electrical characteristic of the wiring pattern, based on a determination of a second value related to a contact state of the at least two pairs of contact probes to the two respective test points.

2 . The circuit board testing apparatus of claim 1 wherein the measurement of the first value is a four-terminal measurement.

3 . The circuit board testing apparatus of claim 2 wherein the control part is configured to perform the determination the second value by:
holding the circuit board in contact with the contact probes,
connecting at least two pairs of contact probes together in a series via the respective connection terminals and the circuit board,
applying power from the power supply part to the series via at least one of said upstream power terminals and at least on one of said downstream power terminals,
measuring, using the voltage detection part, a voltage across the series via at least one of said upstream voltage detection terminals and one of said downstream voltage detection terminals; and
calculating the second value based on the measured voltage.

4 . The circuit board testing apparatus of claim 3 wherein the control part further comprises:
a selection part configured to selectively switch said connections of the respective terminals of the respective contact probes;
a memory part;
a calculation part configured to calculate the first value and the second value, respectively;
a determination part configured to determine the condition of said contact states and the at least one electrical characteristic of said wiring pattern based on the calculated values.

5 . The circuit board testing apparatus of claim 4 , wherein the second value is a resistance value of the series.

6 . The circuit board testing apparatus of claim 5 wherein the first value is a resistance value of the wiring pattern.

7 . The circuit board testing apparatus of claim 6 wherein the memory part stores a predetermined range of resistance values corresponding to the first value and the second value, respectively.

8 . The circuit board testing apparatus of claim 7 wherein the control part is configured to reposition the circuit board in contact with the contact probes based on a comparison of the second value to the predetermined range of resistance values.

9 . A circuit board testing method comprising:
a) providing a testing apparatus configured to test a wiring pattern formed of a plurality of wires on a circuit board, the test based on a measurement of a first value, the testing apparatus having at least two pairs of contact probes, the test probes each having:
an upstream power terminal having a switchable connection to an upstream side of a power supply part,
a downstream power terminal having a switchable connection to a downstream side of the power supply part,
an upstream voltage detection terminal having a switchable connection to an upstream side of a voltage detection part,
a downstream voltage detection terminal having a switchable connection to a downstream side of the voltage detection part, and
a switchable connection terminal;
b) holding the circuit board in contact with the contact probes; c) connecting the at least two pairs of contact probes together in a series via the respective connection terminals and the circuit board; d) applying power from the power supply part to the series via at least one of said upstream power terminals and at least one of said downstream power terminals; e) measuring, using the voltage detection part, a voltage across the series via at least one of said upstream voltage detection terminals, and one of said downstream voltage detection terminals; f) calculating a second value, for an electrical characteristic of the series based on the measured voltage; and g) determining a contact state of the at least two pairs of contact probes, each pair to one of at least two test points defined on the wiring pattern, based on the second value.

10 . The method of claim 9 wherein the testing apparatus is configured to perform a continuity test.

11 . The method of claim 9 wherein determining in g) comprises comparing the second value to a predetermined range of second values for said characteristic.

12 . The method of claim 11 further comprising:
h) performing a four-terminal measurement of the resistance of said wiring pattern to obtain said first value.

13 . The method of claim 12 wherein g) is performed prior to h).

14 . The method of claim 13 further comprising repeating b)-g) if the value compared in g) falls outside of the predetermined range of second values.

15 . The method of claim 14 wherein the connecting in c) further comprises selectively switching said connections of the respective terminals of the respective contact probes via a selecting part, and wherein said testing apparatus includes a control part comprising said selecting part, and a memory part for storing the values of said predetermined range of second values.

16 . The method of claim 9 wherein the applying power in d) further comprises applying power alternately from said at least one upstream power terminal and then from said at least one downstream power terminal prior to e).

17 . The method of claim 12 further comprising:
i) determining a test result of said electrical characteristic of the wiring pattern based on the first value.

18 . The method of claim 18 wherein determining in i) comprises comparing the first value to a predetermined range of first values for said characteristic.

19 . The method of claim 19 wherein said testing apparatus includes a memory part for storing the values of said predetermined range of first values.

20 . A circuit board testing apparatus for conducting a continuity test on a wiring pattern formed of a plurality of wires on a circuit board, and performing a four-terminal measurement on test points defined on each wire with a pair of contact probes brought into conductive contact with each test point, in the continuity test,
the circuit board testing apparatus comprising: a power supply part configured to apply power between the test points; upstream-side power supply terminals provided for the contact probes in a one-to-one correspondence and connectable to an upstream side of the power supply part; downstream-side power supply terminals provided for the contact probes in a one-to-one correspondence and connectable to a downstream side of the power supply part; a

Assignees

• Nidec Read Corp

Inventors

• Yamashita Munehiro

Classifications

• G01R31/54

  Testing for continuity · CPC title

• G01R31/2812 Primary

  Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance (of connections G01R31/66) · CPC title

• G01R31/2806 Primary

  Apparatus therefor, e.g. test stations, drivers, analysers, conveyors (G01R31/2805, G01R31/281, G01R31/2818 take precedence) · CPC title

• G01R1/07307

  with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card · CPC title