Semiconductor die pick-up apparatus and method of picking up semiconductor die using the same

Patent metadata

Field	Value
Publication number	US-9028649-B2
Application number	US-201313834708-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Sep 28, 2010
Publication date	May 12, 2015
Grant date	May 12, 2015

Abstract

Provided is a semiconductor die pick-up apparatus including a stage, a suction opening, a cover that opens and closes a suction opening, and projections and primary holes arranged at a circumferential edge of the suction opening and project from a contact surface. When picking up a semiconductor die, in a state in which at least a portion of a contour of the semiconductor die sticks out from the projections toward the outer circumference of the stage, a retaining sheet at the portion sticking out from the primary holes is suctioned, a tip end of the cover is caused to advance upward, the cover is caused to slide while pushing the retaining sheet and the semiconductor die upward to open the suction opening sequentially, the opened suction opening is caused to suction the retaining sheet sequentially to separate the retaining sheet from the semiconductor die.

First claim

The invention claimed is:

1. A semiconductor die pick-up apparatus for picking up a semiconductor die applied to a retaining sheet, the apparatus comprising:
a stage comprising a contact surface configured to be in close contact with a first surface of the retaining sheet, the first surface being opposite of a second surface to which the semiconductor die is applied;
a suction opening provided in the contact surface;
a cover provided for the stage so as to allow a tip end of t…

Assignees

• Shinkawa Kk

Inventors

• Nakazawa Motoki
• Sasaki Shinichi
• Fujii Akiko

Classifications

• H10P72/7404

  Electricity · mapped topic

• H10W72/071

  Electricity · mapped topic

• H10W72/073

  Electricity · mapped topic

• H10W72/07178

  Electricity · mapped topic

• H10W72/354

  Electricity · mapped topic