Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die
US8993376B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8993376-B2 |
| Application number | US-201113284811-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 28, 2011 |
| Priority date | Aug 16, 2010 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A semiconductor device has a base substrate with first and second opposing surfaces. A plurality of cavities and base leads between the cavities is formed in the first surface of the base substrate. The first set of base leads can have a different height or similar height as the second set of base leads. A concave capture pad can be formed over the second set of base leads. Alternatively, a plurality of openings can be formed in the base substrate and the semiconductor die mounted to the openings. A semiconductor die is mounted between a first set of the base leads and over a second set of the base leads. An encapsulant is deposited over the die and base substrate. A portion of the second surface of the base substrate is removed to separate the base leads. An interconnect structure is formed over the encapsulant and base leads.
First claim
Opening claim text (preview).
What is claimed: 1. A method of making a semiconductor device, comprising: providing a base substrate; removing a first portion of the base substrate to form a plurality of first base leads including a first height and a plurality of second base leads including a second height different from the first height, wherein the first height is greater than the second height; providing a first semiconductor die including a plurality of electrical contact pads formed directly on a surf…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8993376B2 cover?
- A semiconductor device has a base substrate with first and second opposing surfaces. A plurality of cavities and base leads between the cavities is formed in the first surface of the base substrate. The first set of base leads can have a different height or similar height as the second set of base leads. A concave capture pad can be formed over the second set of base leads. Alternatively, a plu…
- Who is the assignee on this patent?
- Camacho Zigmund R, Espiritu Emmanuel A, Bathan Henry D, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).