Chip scale module package in BGA semiconductor package
US-9281300-B2 · Mar 8, 2016 · US
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Espiritu Emmanuel A patents
Espiritu Emmanuel A holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Mar 31, 2015 |
| Latest publication | Mar 8, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps
US-9006031-B2 · Apr 14, 2015 · US
Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die
US-8993376-B2 · Mar 31, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Chip scale module package in BGA semiconductor package
US-9281300-B2 · Mar 8, 2016 · US
Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps
US-9006031-B2 · Apr 14, 2015 · US
Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die
US-8993376-B2 · Mar 31, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W74/00 | 3 |
| H10W90/00 | 3 |
| H01L2924/00 | 3 |
| H01L2924/014 | 3 |
| H10W90/754 | 2 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |