Semiconductor device and method of forming package-on-package structure electrically interconnected through TSV in WLCSP
US-9922955-B2 · Mar 20, 2018 · US
Merilo Dioscoro A holds 6 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 6 |
| Recent patents | 0 |
| First publication | Mar 31, 2015 |
| Latest publication | Mar 20, 2018 |
Year-over-year patent counts for this assignee.
Latest publications where this party is an assignee.
US-9922955-B2 · Mar 20, 2018 · US
US-9406619-B2 · Aug 2, 2016 · US
US-9293385-B2 · Mar 22, 2016 · US
US-9142514-B2 · Sep 22, 2015 · US
US-9064876-B2 · Jun 23, 2015 · US
Representative or frequently cited publications from precomputed assignee stats.
US-9922955-B2 · Mar 20, 2018 · US
US-9406619-B2 · Aug 2, 2016 · US
US-9293385-B2 · Mar 22, 2016 · US
US-9142514-B2 · Sep 22, 2015 · US
US-9064876-B2 · Jun 23, 2015 · US
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 6 |
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