Wafer processing method
US-2024395620-A1 · Nov 28, 2024 · US
Method and apparatus for peeling electronic component
US8991464B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8991464-B2 |
| Application number | US-201213588506-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 17, 2012 |
| Priority date | Mar 26, 2008 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.
First claim
Opening claim text (preview).
What is claimed is: 1. A peeling apparatus for an electronic component that is adhered onto a tape member, comprising: a bellowphragm that is arranged on a side of the tape member, opposite to a side on which the electronic component is provided; a vacuum device that is arranged above the bellowphragm and that vacuums the electronic component; a fluid supply device that supplies a fluid to the bellowphragm to deform the bellowphragm to thereby peel the electronic component fro…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10P72/0442Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US8991464B2 cover?
- A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and…
- Who is the assignee on this patent?
- Konno Yoshito, Yamada Yutaka, Fujitsu Semiconductor Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0442. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).