Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-8981550-B2
Application number	US-201213725645-A
Country	US
Kind code	B2
Filing date	Dec 21, 2012
Priority date	Feb 16, 2012
Publication date	Mar 17, 2015
Grant date	Mar 17, 2015

Abstract

A semiconductor package improves reliability of heat emitting performance by maintaining a heat emitting lid stacked on a top surface of a semiconductor chip at a tightly adhered state. A highly adhesive interface material and a thermal interface material are applied to the top surface of the semiconductor chip. The highly adhesive interface material insures that the heat emitting lid is bonded to the top surface while the thermal interface material insures excellent heat transfer between the top surface and the heat emitting lid.

First claim

What is claimed is:

1. A semiconductor package comprising:
a semiconductor chip comprising an inactive surface;
an adhesive interface material adhered to an adhesive region of the inactive surface;
a thermal interface material adhered to a heat transfer region of the inactive surface; and
a heat emitting lid adhered to the inactive surface by the adhesive interface material and the thermal interface material, wherein the adhesive interface material has a greater bonding strength than the thermal interface material.

2. The semiconductor package of claim 1 wherein the thermal interface material has a higher heat transmission efficiency than the adhesive interface material.

3. The semiconductor package of claim 1 wherein the adhesive region and the heat transfer region form the entire inactive surface.

4. The semiconductor package of claim 1 further comprising:
a substrate; and
conductive bumps coupling an active surface of the semiconductor chip to the substrate.

5. The semiconductor package of claim 4 wherein the heat emitting lid comprises:
a flat plate adhered to the inactive surface; and
legs adhered to the substrate.

6. The semiconductor package of claim 5 comprising an adhesive substrate interface material adhering the legs to the substrate.

7. The semiconductor package of claim 6 wherein the adhesive substrate interface material and the adhesive interface material are the same type of material.

8. The semiconductor package of claim 1 , wherein the adhesive region comprises corner regions on the inactive surface of the semiconductor chip.

9. The semiconductor package of claim 1 , wherein the adhesive region comprises edge regions on the inactive surface of the semiconductor chip.

10. The semiconductor package of claim 1 , wherein the adhesive region comprises a central portion, corner regions and edge regions on the inactive surface of the semiconductor chip.

11. The semiconductor package of claim 1 , wherein the adhesive interface material is applied in a shape comprising one or more of the following: a circle, an oval and a polygon with rounded edges.

12. A semiconductor package comprising:
a substrate;
a semiconductor chip;
bumps conductively attaching the semiconductor chip to the substrate;
a heat emitting lid attached to an inactive surface of the semiconductor chip and edge regions of a top surface of the substrate, wherein the heat emitting lid is adhered and fixed to a highly adhesive interface material while also being adhered to a thermal interface material having a high heat transmission efficiency throughout the inactive surface of the semiconductor chip, the highly adhesive interface material being applied to an adhesive region of the inactive surface of the semiconductor chip and the thermal interface material being applied at a heat transfer region of the inactive surface of the semiconductor chip different from the adhesive region.

13. The semiconductor package of claim 12 , wherein the adhesive interface material is applied to corner regions on the inactive surface of the semiconductor chip.

14. The semiconductor package of claim 12 , wherein the adhesive interface material is applied to edge regions on the inactive surface of the semiconductor chip.

15. The semiconductor package of claim 12 , wherein the adhesive interface material is applied to a central portion, corner regions and edge regions on the inactive surface of the semiconductor chip.

16. The semiconductor package of claim 12 , wherein the adhesive interface material is applied in a shape comprising one or more of the following: a circle, an oval and a polygon with rounded edges.

17. The semiconductor package of claim 12 , wherein the heat emitting lid is adhered to the inactive surface of the semiconductor chip and to the edge regions of the top surface of the substrate using a same adhesive.

18. The semiconductor package of claim 12 , wherein the adhesive interface material has a greater bonding strength than the thermal interface material, and the thermal interface material has a higher heat transmission efficiency than the adhesive interface material.

19. A semiconductor package comprising:
a substrate;
a semiconductor chip comprising an active surface and an inactive surface;
bumps conductively attaching the active surface of the semiconductor chip to the substrate;
a heat emitting lid attached to the inactive surface of the semiconductor chip using both an epoxy-based adhesive material and an epoxy resin-based thermal interface material.

20. A method for a semiconductor package, the method comprising:
providing a semiconductor package, the package comprising:
a semiconductor chip comprising an inactive surface;
an adhesive interface material adhered to an adhesive region of the inactive surface;
a thermal interface material adhered to a heat transfer region of the inactive surface; and
a heat emitting lid adhered to the inactive surface by the adhesive interface material and the thermal interface material, wherein the adhesive interface material has a greater bonding strength than the thermal interface material.

21. The method of claim 20 wherein the thermal interface material has a higher heat transmission efficiency than the adhesive interface material.

22. The method of claim 20 wherein the adhesive region and the heat transfer region form the entire inactive surface.

Assignees

• Amkor Technology Inc

Inventors

• Park Joon Young
• Jeong Jin Suk
• Seong Kyeong Sool
• Lee Seo Won

Classifications

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/321

  Structures or relative sizes of die-attach connectors · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/332

  Plan-view shape, i.e. in top view · CPC title