Semiconductor device with face-to-face chips on interposer and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9147667-B2
Application number	US-201414523892-A
Country	US
Kind code	B2
Filing date	Oct 26, 2014
Priority date	Oct 25, 2013
Publication date	Sep 29, 2015
Grant date	Sep 29, 2015

Abstract

A method of making a semiconductor device with face-to-face chips on interposer includes the step of attaching a chip-on-interposer subassembly on a heat spreader with the chip inserted into a cavity of the heat spreader so that the heat spreader provides mechanical support for the interposer. The heat spreader also provides thermal dissipation, electromagnetic shielding and moisture barrier for the enclosed chip. In the method, a second chip is also electrically coupled to a second surface of the interposer and an optional second heat spreader is attached to the second chip.

First claim

What is claimed is:

1. A method of making a semiconductor device with face-to-face chips on interposer, comprising the steps of:
providing an interposer that includes a first surface, a second surface opposite to the first surface, first contact pads on the first surface, second contact pads on the second surface, and through vias that electrically couple the first contact pads and the second contact pads;
electrically coupling a first chip to the first contact pads of the inter…

Assignees

• Bridge Semiconductor Corp

Inventors

• Lin Charles W C
• Wang Chia-Chung

Classifications

• H10W90/736

  Electricity · mapped topic

• H10W90/734

  Electricity · mapped topic

• H10W90/724

  Electricity · mapped topic

• H10W90/288

  Electricity · mapped topic

• H10W90/22

  Electricity · mapped topic