Method of extracting properties of a layer on a wafer
US-2024234216-A9 · Jul 11, 2024 · US
US8945954B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8945954-B2 |
| Application number | US-201113325228-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 14, 2011 |
| Priority date | Dec 14, 2010 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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There is provided an inspection method for inspecting a substrate supporting portion configured to support a substrate during an exposure performed by an exposure apparatus, the method including: irradiating a surface of the exposed substrate with an illumination light beam; detecting reflected light from a pattern in the irradiated surface; determining a focusing state at the time of exposing the pattern of the substrate based on the detected reflected light; and inspecting a state of the substrate supporting portion based on the focusing state.
Opening claim text (preview).
What is claimed is: 1. An inspection method for inspecting a substrate supporting portion configured to support a substrate during an exposure performed by an exposure apparatus, the method comprising: irradiating, with an illumination light beam, a surface of the substrate on which a pattern has been formed by an exposure; detecting reflected light from a pattern in the irradiated surface; determining a focusing state of the pattern of the substrate based on the detected refl…
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