Method of transferring a laminate and method of manufacturing a semiconductor device

Patent metadata

Field	Value
Publication number	US-8945331-B2
Application number	US-50242809-A
Country	US
Kind code	B2
Filing date	Jul 14, 2009
Priority date	May 17, 2002
Publication date	Feb 3, 2015
Grant date	Feb 3, 2015

Abstract

An object of the present invention is to provide a method of transferring an object to be peeled onto a transferring member in a short time without imparting damage to the object to be peeled within a laminate. Also, another object of the present invention is to provide a method of manufacturing a semiconductor device in which a semiconductor element manufactured on a substrate is transferred onto a transferring member, typically, a plastic substrate. The methods are characterized by including: forming a peeling layer and an object to be peeled on a substrate; bonding the object to be peeled and a support through a two-sided tape; peeling the object to be peeled from the peeling layer by using a physical method, and then bonding the object to be peeled onto a transferring member; and peeling the support and the two-sided tape from the object to be peeled.

First claim

What is claimed is:

1. A method for manufacturing a semiconductor device comprising:
forming a semiconductor element over a first substrate with a peeling layer interposed therebetween;
bonding a support to the semiconductor element with a two-sided tape interposed therebetween;
peeling the semiconductor element from the first substrate at the peeling layer;
bonding the semiconductor element to a first transferring member with an adhesive interposed therebetween;
peeling t…

Assignees

• Takayama Toru
• Goto Yuugo
• Maruyama Junya
• Ohno Yumiko
• Semiconductor Energy Lab

Inventors

• Takayama Toru
• Goto Yuugo
• Maruyama Junya
• Ohno Yumiko

Classifications

• H10P72/7434

  Electricity · mapped topic

• H10W10/181

  Electricity · mapped topic

• H10P90/1914 Primary

  Electricity · mapped topic

• H10D86/0214 Primary

  Electricity · mapped topic

• Y10T428/14

  Cross-Sectional Technologies · mapped topic