Multi-compartment electrical apparatus with shared cooling assembly
US-11864358-B2 · Jan 2, 2024 · US
Metal bumps for cooling device connection
US8941232B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8941232-B2 |
| Application number | US-201113034263-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 24, 2011 |
| Priority date | Feb 24, 2011 |
| Publication date | Jan 27, 2015 |
| Grant date | Jan 27, 2015 |
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Abstract
Official abstract text for this publication.
The mechanisms for forming metal bumps to connect to a cooling device (or a heat sink) described herein enable substrates with devices to dissipate heat generated more efficiently. In addition, the metal bumps allow customization of bump designs to meet the needs of different chips. Further, the usage of metal bumps between the semiconductor chip and cooling device enables advanced cooling by passing a cooling fluid between the bumps.
First claim
Opening claim text (preview).
The invention claimed is: 1. A packaged substrate with a heat sink, comprising: a packaging substrate; a heat sink; and a semiconductor substrate, wherein the semiconductor substrate has a plurality of first-side metal bumps on a first side of the substrate physically connected to the packaging substrate, and wherein the semiconductor substrate has a plurality of second-side metal bumps on a second side of the semiconductor substrate physically connected to the heat sink, and…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8941232B2 cover?
- The mechanisms for forming metal bumps to connect to a cooling device (or a heat sink) described herein enable substrates with devices to dissipate heat generated more efficiently. In addition, the metal bumps allow customization of bump designs to meet the needs of different chips. Further, the usage of metal bumps between the semiconductor chip and cooling device enables advanced cooling by p…
- Who is the assignee on this patent?
- Chou You-Hua, Lai Yi-Jen, Chen Chun-Jen, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10W40/70. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 27 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).