Substrate processing apparatus, substrate transfer method and substrate transfer device
US-9530676-B2 · Dec 27, 2016 · US
Substrate processing apparatus
US2026101709A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2026101709-A1 |
| Application number | US-202319112591-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 7, 2023 |
| Priority date | Sep 21, 2022 |
| Publication date | Apr 9, 2026 |
| Grant date | — |
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Abstract
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There is provided a substrate processing apparatus with improved throughput by reconsidering a configuration of an apparatus including a batch type module and a single wafer type module. In a single wafer processing region according to single wafer processing of a processing block of the present invention, a buffer unit to and from which both a first transfer mechanism and a center robot can hand over and receive a substrate(s) is provided. Therefore, the first transfer mechanism can collectively hand over and receive processed substrates and unprocessed substrates via the buffer unit. Therefore, a potential of the first transfer mechanism is drawn out, and the substrate processing apparatus having a high throughput can be provided.
First claim
Opening claim text (preview).
1 . A substrate processing apparatus that continuously performs batch processing of collectively processing a plurality of substrates and single wafer processing of processing substrates one by one, the substrate processing apparatus comprising: a stocker block; a transfer block adjacent to the stocker block; and a processing block adjacent to the transfer block, wherein the stocker block accommodates at least one carrier that stores a plurality of substrates in a horizontal attitude at p…
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Mechanical Engineering · mapped topic
Operations & Transport · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US2026101709A1 cover?
- There is provided a substrate processing apparatus with improved throughput by reconsidering a configuration of an apparatus including a batch type module and a single wafer type module. In a single wafer processing region according to single wafer processing of a processing block of the present invention, a buffer unit to and from which both a first transfer mechanism and a center robot can ha…
- Who is the assignee on this patent?
- Screen Holdings Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/3211. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Apr 09 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).