High temperature biasable heater with advanced far edge electrode, electrostatic chuck, and embedded ground electrode
US-2024412957-A1 · Dec 12, 2024 · US
Substrate carrier with integrated electrostatic chuck
US2016211162A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016211162-A1 |
| Application number | US-201414916676-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 18, 2014 |
| Priority date | Sep 20, 2013 |
| Publication date | Jul 21, 2016 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A substrate carrier adapted to use in a processing system includes an electrode assembly and a support base. The electrode assembly is configured to generate an electrostatic chucking force for securing a substrate to the substrate carrier. The support base has a heating/cooling reservoir formed therein. The electrode assembly and the support base form an unitary body configured for transport within a processing system. A quick disconnect is coupled to the body and configured to trap a heat regulating medium in the reservoir heating/cooling reservoir when the body is decoupled from a source of heat regulating medium.
First claim
Opening claim text (preview).
What is claimed is: 1 . A substrate carrier adapted to use in a processing system, the substrate carrier comprising: a support base; an electrode assembly having interleaved electrode fingers formed therein disposed on the support base; and a connector coupled to the support base configured to electrically disconnect a power source to the electrode assembly, the support base and the electrode assembly comprising a unitary body adapted to be transported within a processing sy…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2016211162A1 cover?
- A substrate carrier adapted to use in a processing system includes an electrode assembly and a support base. The electrode assembly is configured to generate an electrostatic chucking force for securing a substrate to the substrate carrier. The support base has a heating/cooling reservoir formed therein. The electrode assembly and the support base form an unitary body configured for transport w…
- Who is the assignee on this patent?
- Applied Materials Inc
- What technology area does this patent fall under?
- Primary CPC classification H10P72/722. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jul 21 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).