Circuit package for connecting to an electro-photonic memory fabric
US-2024345316-A1 · Oct 17, 2024 · US
Photonic integrated circuit packaging architecture
US2026099001A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2026099001-A1 |
| Application number | US-202519415951-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 11, 2025 |
| Priority date | Apr 22, 2021 |
| Publication date | Apr 9, 2026 |
| Grant date | — |
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Abstract
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Photonic packages and device assemblies that include photonic integrated circuits (PICs) coupled to optical lenses on lateral sides of the PICs. An example photonic package comprises a package support, an integrated circuit (IC), an insulating material, a PIC having an active side and a lateral side substantially perpendicular to the active side. At least one optical structure is on the active side. A substantial portion of the active side is in contact with the insulating material, and the PIC is electrically coupled to the package support and to the IC. The photonic package further includes an optical lens coupled to the PIC on the lateral side. In some embodiments, the photonic package further includes an interposer between the PIC or the IC and the package support.
First claim
Opening claim text (preview).
1 . An integrated circuit (IC) device assembly, comprising: a circuit board; a package support above the circuit board, the package support having a first surface and a second surface opposite the first surface; conductive contacts between the circuit board and the first surface of the package support; a photonic integrated circuit (PIC) die over a first portion of the second surface of the package support, wherein the PIC die includes a waveguide, an optical modulator, a photodetector, a…
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Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US2026099001A1 cover?
- Photonic packages and device assemblies that include photonic integrated circuits (PICs) coupled to optical lenses on lateral sides of the PICs. An example photonic package comprises a package support, an integrated circuit (IC), an insulating material, a PIC having an active side and a lateral side substantially perpendicular to the active side. At least one optical structure is on the active …
- Who is the assignee on this patent?
- Intel Corp
- What technology area does this patent fall under?
- Primary CPC classification G02B6/1225. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Thu Apr 09 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).