Gas injection and pre-heating for selective gas activation, and related processing chambers, apparatus, and methods

Patent metadata

Field	Value
Publication number	US-2026062807-A1
Application number	US-202418950682-A
Country	US
Kind code	A1
Filing date	Nov 18, 2024
Priority date	Aug 30, 2024
Publication date	Mar 5, 2026
Grant date	—

Abstract

The present disclosure relates to gas injection and pre-heating for selective gas activation, and related chamber kits, methods, and processing chambers. In one or more embodiments, a processing chamber includes a chamber body at least partially defining an internal volume. A substrate support is disposed in the internal volume. A gas assembly is coupled to the chamber body. The gas assembly includes an injector operable to flow a gas into the internal volume. A plurality of gas lines are fluidly connected to the injector and at least one heater is operable to heat the gas.

First claim

What is claimed is:

1 . A processing chamber, comprising:
a chamber body at least partially defining an internal volume; a substrate support disposed in the internal volume; and a gas assembly coupled to the chamber body, the gas assembly comprising:
an injector operable to flow a gas into the internal volume,
a plurality of gas lines fluidly connected to the injector, and
at least one heater operable to heat the gas.

2 . The processing chamber of claim 1 , wherein the at least one heater comprises a coil disposed about at least one of the plurality of gas lines.

3 . The processing chamber of claim 1 , wherein the at least one heater comprises a heater rod disposed in at least one flow opening of the injector such that the gas flows about the heater rod.

4 . The processing chamber of claim 1 , wherein the at least one heater is a resistive heater.

5 . The processing chamber of claim 1 , wherein at least one heater comprises one or more of silicon carbide, a metallic material, or a ceramic material.

6 . The processing chamber of claim 1 , wherein the plurality of gas lines comprise heated gas lines and thermally passive gas lines disposed in an alternating arrangement with respect to each other.

7 . The processing chamber of claim 1 , wherein the injector comprises one or more cooling channels, and an insulator disposed in at least one flow opening of the injector.

8 . The processing chamber of claim 7 , wherein the insulator is formed of quartz.

9 . The processing chamber of claim 1 , wherein the injector comprises a hatch and a seal.

10 . A gas assembly, comprising:
an injector comprising one or more flow openings; one or more gas lines fluidly coupled to the one or more flow openings of the injector; and
one or more resistive heaters disposed within at least one of the one or more flow openings;
a hatch coupled the injector, the hatch at least partially supporting the one or more resistive heaters;
a seal disposed about at least one of the one or more resistive heaters; and
one or more electrical lines coupled to the hatch, the one or more electrical lines electrically connected to the one or more resistive heaters.

11 . The gas assembly of claim 10 , the one or more flow openings comprise an heated flow openings and thermally passive flow openings disposed in an alternating arrangement with respect to each other.

12 . The gas assembly of claim 10 , further comprising a power source electrically connected to the one or more electrical lines.

13 . The gas assembly of claim 10 , wherein the one or more resistive heaters comprise a coil, a wire, a rod, or a combination thereof.

14 . The gas assembly of claim 10 , wherein the one or more resistive heaters comprise silicon carbide, a metallic material, or a ceramic material.

15 . The gas assembly of claim 10 , wherein the injector comprises one or more cooling channels.

16 . The gas assembly of claim 10 , wherein the injector comprises an insulator in at least one flow opening of the injector.

17 . A method of substrate processing comprising:
applying a power to a heater disposed along a portion of a gas flow path; flowing one or more process gases along the gas flow path into an injector of a processing chamber; heating the one or more process gases prior to the one or more process gases flowing out of the injector; and flowing the one or more process gases into a processing volume of the processing chamber.

18 . The method of claim 17 , wherein the heater is disposed around one or more gas lines fluidly coupled to the injector, and the one or more process gases are heated by the heater while the one or more process gases flow through the one or more gas lines.

19 . The method of claim 17 , wherein the heater is disposed within one or more flow openings of the injector, and the one or more process gases are heated by the heater while the one or more process gases flow through the one or more flow openings of the injector.

20 . The method of claim 17 , wherein the heater comprises a rod electrically coupled to a power source through a hatch disposed in the injector.

Assignees

• Applied Materials Inc

Inventors

• Lau Shu-Kwan
• Choo Enle
• Palaty Abraham
• Patil Aniketnitin
• Gadgil Shantanu Rajiv
• Moradian Ala
• Salinas Martin Jeffrey

Classifications

• C23C16/4583

  the substrate being supported substantially horizontally · CPC title

• C23C16/45561 Primary

  Gas plumbing upstream of the reaction chamber · CPC title

• C23C16/4557

  Heated nozzles · CPC title

• C23C16/46 Primary

  characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence) · CPC title

• C30B25/10

  Heating of the reaction chamber or the substrate · CPC title